Advanced Component Testing Announces the Purchase of the Glenbrook Technology Jewel Box Real Time X-ray Machine

The Jewel Box x-ray inspection system becomes a powerful tool to evaluate electronic components, including BGAs, Micro-BGAs and flip chips. The x-ray delivers superior image quality with excellent resolution and sensitivity for laboratory and failure analysis applications.

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Ronkonkoma, NY (PRWEB) February 14, 2013

Advanced Component Testing has announced today that it has purchased and installed the Glenbrook Technology Jewel Box real time x-ray machine. The Jewel Box x-ray inspection system becomes a powerful tool to evaluate electronic components, including BGAs, Micro-BGAs and flip chips. The x-ray delivers superior image quality with excellent resolution and sensitivity for laboratory and failure analysis applications. This will allow us to quickly view a complete component image in order to verify die size, die location, wire bond pattern and internal lead characteristics that are specific to a particular manufacture’s product type. This machine will help ensure authenticity of the parts. With counterfeiting techniques becoming more refined and difficult to spot, this machine will play a critical role in detecting substandard products. In addition the real time x-ray is used to check component defects such as open wire bond connections, BGA solder ball attachment and ESD damage.
Advanced Component Testing is always looking at ways to broaden their electronic component testing capabilities and offer the latest in testing techniques. We are dedicated to using the most current counterfeit detection technology combined with our proprietary database, experienced engineers, testing procedures and state of the equipment to make ACT a leader in detection of counterfeit components.

About ACT’s Product Authenticity Services:
Electrical Testing, Group A Electrical Testing, Solderability, IC Decapsultation/De-lidding, Internal Visual Die Verification, Material Analysis/Device Composition, Component Surface Inspection, X-ray Die Bond and Frame Verification, Physical Dimension, Marking Permanency, XRF Spectrum Analysis, Comprehensive report, Proprietary OCM Die database, Engineering review, Solderability Testing, Bake/Dry Pack, Tape/Reeling.

Media Contacts:
Tim Nese
Advanced Components Testing
+ 1 (631) 676-6390
email: tnese(at)actestlab(dot)com
http://www.actestlab.com


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