Olivier Brunet, Product and Marketing director at SPS, declares: “With the addition of this platform based on STMicroelectronics solution, our customers are given more options to ensure they satisfy the booming demand for dual interface banking cards."
Rousset, France (PRWEB) April 22, 2013
Smart Packaging Solutions is happy to announce the addition of a new dual interface platform EMV certified solution to its offer.
This dual interface EMV solution allows card manufacturers to propose dual interface banking cards based on a JavaCard operating system, fully certified by Visa, MasterCard and Interac. This platform is now qualified by SPS, and can be delivered to card manufacturers, enabling them to benefit from the EBooster® technology.
Olivier Brunet, Product and Marketing director at SPS, declares: “With the addition of this platform based on STMicroelectronics solution, our customers are given more options to ensure they satisfy the booming demand for dual interface banking cards. This choice of platforms associated with the manufacturing cost reduction brought by SPS EBooster® technology ensures card manufacturers are in the best position to answer market demand.”
With this addition, thanks to SPS EBooster® technology and modular approach, smart card manufacturers are given a full set of options: they can select between major semi-conductor vendors, and choose native, JavaCard or Multos based operating systems. This way, smart card manufacturers are able to adapt easily to the complexity of market demand and ensure they are able to deliver banking cards fitting all financial institutions requirements.
With this modular approach, SPS’s customers are ideally positioned to benefit both from mature smart card based banking markets, for instance in Europe, Asia or Latin America, and from upcoming developments such as the United States and China.
SPS EBooster® technology allows smart card manufacturers of all sizes to deliver reduced-cost high-performance dual technology cards to financial institutions issuing banking cards. SPS platform consists in a micro-module with contacts for EMV contact transactions integrating a small antenna, and an inlay with a full card size antenna, coupled with the small antenna, allowing an efficient communication in contactless mode between the card and the reader. This way, and because there is no physical connection between both antennas, cards are highly reliable, and even allow five lines of embossing in the ISO-defined area. Thanks to the EBooster® technology, smart card vendors are able to deliver dual technology contact & contactless cards without costly investments in their production line. They can easily integrate a stable process that guarantees high yield rates and reduced unit manufacturing costs for their dual interface card embedding process.
With more than 20 years of experience in the field of smart card technologies, Smart Packaging Solutions is specialized in the design, manufacturing and sale of contactless solutions dedicated to ID cards, e-passport and dual interface banking cards. Headquartered in Rousset, France, SPS employs 100 people. The company specializes in contactless and dual-interface products, with a recognized micro packaging expertise. SPS has filed over 120 patents supporting its exclusive technologies. More information at http://www.s-p-s.com.