With Physware's PhysWAVE, Renesas can analyze, with high precision and rapidly, 3D structures, including the signals, power supplies, and ground for signal lines that are 32-bit and beyond, over broadband frequences, ranging from DC to 20GHz or more
Bellevue, WA (PRWEB) June 9, 2010
Physware, a leading provider of high-speed and high capacity 3D electro-magnetic solutions for Signal Integrity (SI), Power Integrity (PI), Electromagnetic Interference (EMI) and Simultaneous Noise Integrity (SNI), today announced that Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, has adopted Physware’s PhysWAVE electromagnetic simulation technology to design low-cost wire-bonding BGA packages. Physware’s technology will enable Renesas to implement a next-generation double data rate (DDR) memory interface that supports data transfer rates of 2 Gbps (gigabits per second) and above.
With PhysWAVE, Renesas can analyze, with high precision and in a short period of time, 3D structures, including the signals, power supplies, and ground for signal lines that are 32-bit and beyond, over broadband, ranging from low frequencies close to direct current (DC) to high frequencies up to 20 gigahertz (GHz), according to Renesas Electronics’ and Physware’s paper presented at the 60th Electronic Components and Technology Conference in Las Vegas.
“Physware’s technology is based on several proprietary innovations and multiple years of research that allows us to provide highly-accurate 3D EM solutions that are multiple orders of magnitude faster compared to what is commercially available today,” said Dr. Dipanjan Gope, Vice President of R&D at Physware.
“It is important that our customers are able to design with confidence and successfully address Signal Integrity (SI), Power Integrity (PI), Simultaneous Switching Noise/Output (SSN/SSO) and Electromagnetic Interference (EMI) issues not only on sub-systems, but on the entire system across chip, package and board,” said Bala Vishwanath, President & CEO of Physware. “It is with keeping this in mind that we have designed PhysWAVE from the ground-up to provide the best-in-class speed and capacity while preserving true Maxwell-accuracy.”
PhysWAVE supports industry standard input and output formats with an easy-to-use intuitive graphical user interface featuring automatic port setup, flexible chip-package-board layout merge and automatic refined meshing. Based on innovative integral equation methods that employ finely tuned order-N fast hierarchical algorithms and advanced pre-conditioning methods, PhysWAVE is scalable to meet the needs of the level of complexity in today’s design. PhysWAVE’s multi-threaded architecture accommodates hybrid distributed-shared memory computing systems, providing significant speed up through multiple cores and/or CPUs.
PhysWAVE is currently in production and is generally available at prices starting at $40,000 USD. PhysWAVE supports Windows and Linux OS. For additional information and a demo of the product, visit Physware at http://www.physware.com.
Physware, Inc. provides high-speed and high-capacity 3D electromagnetic signal integrity, power integrity and EMI analysis field solutions for the microelectronics industry. Physware’s accelerated technology delivers unprecedented capacity handling, significantly faster speed than current methodologies, and the ability to span the entire design cycle while maintaining concurrent, uncompromising Maxwell accuracy.
Physware is a venture-backed, privately-held company led by an experienced management team. The technology is based on multiple patent-pending methodologies, over one hundred publications and several PhD theses. For additional information, please visit http://www.physware.com.
Media Contact: Bala Vishwanath, Physware, Inc., 800-686-5213, media(at)physware(dot)com
 Ryuichi Oikawa, Dipanjan Gope and Vikram Jandhyala, "A Broadband SSO Modeling for a Weak Signal Return-Path System Based on the Large-Scale Signal-Power Combined Three-Dimensional Full-Wave BEM Solver Model," Proceedings of 60th Electronic Components and Technology Conference, 638 (2010)