AMD Provides Quick Time-to-Market Platform for Growing Networked
Storage Market
Storage Bridge Bay Reference Design and new AMD Athlon™
X2 Dual-Core Processors Deliver More Options for High-End Embedded
Customers
ORLANDO, Fla. (Business Wire EON/PRWEB ) April 6, 2008 --
At the Storage Networking World conference, AMD (NYSE:AMD) today
announced availability of the first Reference Design Kit (RDK) for the
Storage Bridge Bay (SBB) 2.0 Specification based on the AMD Athlon™
processor. This RDK can simplify the design process and provide a
standardized platform powered by AMD’s
unrivaled Direct Connect Architecture. AMD expects to help storage
vendors deliver low power, high performance, entry-level networked
storage systems while helping reduce time-to-market, allowing them to
focus more on specific innovations that their customers require. AMD
also today announced an expansion of its embedded product offerings with
three new, low power AMD Athlon X2 Dual-Core processors for embedded
system designs.
“AMD is focused on enhancing opportunities for
innovation among partners and customers by promoting open industry
standards. This SBB RDK could help our customers reduce the typical
design cycle by three to nine months,” said
Buddy Broeker, director of Embedded Computing Solutions, AMD. “Further,
the new low power additions to our embedded line-up provide system
designers simplicity and flexibility to create innovative,
high-performing embedded systems powered by the exceptional
performance-per-watt and energy-efficiency of AMD processor technology.”
AMD’s new SBB RDK provides storage vendors
with a highly configurable platform with the exceptional data throughput
capabilities of AMD Athlon and AMD Athlon X2 Dual-Core processors
featuring Direct Connect Architecture and HyperTransport™
technology. It allows them to differentiate their systems based on
customer needs while addressing the need for high memory and I/O
bandwidth in networked storage environments. The RDK supports Network
Attached Storage (NAS), Storage Area Networks (SANs), Unified Storage
systems, as well as all major interface connectivity options including
GigE, 10GigE, Fibre Channel, and Infiniband. The RDK includes schematics
and layout source files, with reference design hardware to be available
from AMD partner Newisys Data Storage.
“Newisys Data Storage is extending our long
collaboration with AMD to help grow the ecosystem of standardized
storage building blocks which enable customers of all sizes the
opportunity to deploy advanced storage capabilities,”
said Steve VonderHaar, vice president of product marketing and business
development for Newisys Data Storage. “The
SBB initiative is an integral component in our product roadmap, and we
look forward to launching more SBB-compliant OEM and joint development
designs later this year.”
“The reduced design costs and complexity
delivered by SBB 2.0 combined with enhanced manageability, security, and
reliability of Windows Storage Servers will help promote affordable
enterprise class storage functionality to customers of all sizes,”
said Bala Kasiviswanathan, director of the Storage Solutions marketing
division at Microsoft. “Microsoft is pleased
to collaborate with AMD in delivering the promise of SBB 2.0 to our
joint partners so they can innovate on our platform and build solutions
that better meet the needs of our customers.”
In addition to Microsoft, AMD has also worked with storage software
companies AMI and FalconStor. These additional software developments on
the AMD SBB 2.0 RDK will provide customers several different
implementation options.
Expanding Low Power AMD Embedded Solutions Portfolio
AMD also announced the addition of three new low power AMD Athlon X2
Dual-Core processors to its embedded product roadmap. These will enhance
the available options for deploying industry-changing AMD technology in
embedded systems that span from entry-level networked storage systems
designed with the new RDK, to other high-performance embedded designs
including telecommunications solutions, digital signage, and point of
sale, gaming, and kiosk systems. The new AMD Athlon X2 Dual-Core
processor Models 3400e, 3600+ and 4200+ deliver greater levels of
performance in the same low-power envelopes of 22, 35, and 35W maximum
thermal design power, respectively.
Offering continued platform stability, the new additions are AM2
socket-compatible to help embedded system designers easily upgrade from
single-core or use their existing AM2 board designs to address new
markets with reduced time-to-market and development costs.
The new processors are designed to be paired with the AMD M690E chipset,
offering embedded customers a ready-to-implement, stable and reliable
commercial embedded platform. They can also be combined with other
industry-leading chipsets including the Broadcom HT-2100 and HT-1000
chipsets for performance-hungry yet energy-efficient designs.
Availability is expected in the second quarter of 2008 with embedded
industry-standard component longevity of 5 years.
About AMD
Advanced Micro Devices (NYSE:AMD) is a leading global provider of
innovative processing solutions in the computing, graphics and consumer
electronics markets. AMD is dedicated to driving open innovation, choice
and industry growth by delivering superior customer-centric solutions
that empower consumers and businesses worldwide. For more information,
visit http://www.amd.com.
Cautionary Statement
This release contains forward-looking statements concerning the timing
of availability of products, which are made pursuant to the safe harbor
provisions of the Private Securities Litigation Reform Act of 1995.
Forward-looking statements are commonly identified by words such as “would,”
“may,” “expects,”
“believes,” “plans,”
“intends,” “projects”
and other terms with similar meaning. Investors are cautioned that the
forward-looking statements in this release are based on current beliefs,
assumptions and expectations, speak only as of the date of this release
and involve risks and uncertainties that could cause actual results to
differ materially from current expectations. Risks include the
possibility that Intel Corporation’s pricing,
marketing and rebating programs, product bundling, standard setting, new
product introductions or other activities targeting AMD’s
business will prevent attainment of AMD’s
current plans; AMD will require additional funding and may not be able
to raise funds on favorable terms or at all; customers stop buying the
company’s products or materially reduce their
operations or demand for its products; the company will be unable to
develop, launch and ramp new products and technologies in the volumes
and mix required by the market and at mature yields on a timely basis;
the company’s competitors, customers and
suppliers may take actions that will negate the anticipated benefits of
the company’s acquisition of ATI; demand for
computers and consumer electronics products and, in turn, demand for the
company’s products will be lower than
currently expected; global business and economic conditions will worsen,
resulting in lower than currently expected revenue in the first quarter
of 2008 and beyond; there will be unexpected variations in market growth
and demand for the company’s products and
technologies in light of the product mix that it may have available at
any particular time or a decline in demand; the company will be unable
to transition to advanced manufacturing process technologies in a timely
and effective way, consistent with planned capital expenditures; the
company will be unable to maintain the level of investment in research
and development and capacity that is required to remain competitive; and
the company will be unable to obtain sufficient manufacturing capacity
or components to meet demand for its products or will under-utilize its
microprocessor manufacturing facilities. Investors are urged to review
in detail the risks and uncertainties in the company’s
Securities and Exchange Commission filings, including but not limited to
the Annual Report on Form 10-K for the fiscal year ended December 29,
2007.
AMD, the AMD Arrow logo, AMD Athlon and combinations thereof, are
trademarks of Advanced Micro Devices, Inc. HyperTransport is a licensed
trademark of the HyperTransport Technology Consortium. Other
names are for informational purposes only and may be trademarks of their
respective owners.
MULTIMEDIA GALLERY http://www.businesswire.com/cgi-bin/mmg.cgi?eid=5650911
See the original story at: http://eon.businesswire.com/releases/storage/embedded/prweb836144.htm
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