Global Electronic Thermal Management Market to Reach US$8.6 Billion by 2015, According to a New Report by Global Industry Analysts, Inc.

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GIA announces the release of a comprehensive global report on Electronic Thermal Management markets. The global market for Electronic Thermal Management is forecast to reach US$8.6 billion by the year 2015. Factors driving growth include developments in technology and marked increase in the production of miniaturized microprocessors. Further, increased use of mobile devices is likely to impact market growth.

Electronic Thermal Management: A Global Strategic Business Report

Growth momentum in the electronic thermal management market derailed during the years 2008 and 2009 due to the global economic recession. Decline in various end-use sectors including automotive, computers, telecom, industrial/military, medical/office equipment, and consumer electronics dampened the market prospects during the period. However, with the recovery of global economic scenario in 2010, the market is likely to stabilize and register growth in subsequent years. Developments in technology and marked increase in the production of miniaturized microprocessors along with increased use of mobile devices are likely to impact market growth. In the wake of growing sophistication and functionality of a variety of electronics systems, thermal management has assumed an important role in the management of costs associated with product development and time required for market release. Today’s printed circuit boards (PCBs) need efficient thermal management solutions such as thermoelectric coolers and heat sinks to control rising power densities.

With developments in technology and marked increase in the production of miniaturized microprocessors, demand for electronic thermal management devices is on a rise. The miniature size of the processor and the enhanced power levels generate high levels of heat. Devices are required to moderate this and to cool heat generation. Electronic thermal management devices perform this job and cool the electronic components and the system from excessive heat during operation. Electronic thermal management devices are likely to command a premium market in the coming years for their effective use in PCs, telecommunication systems and servers. Also, demand is likely to increase with system integrators and original equipment manufacturers (OEMs) integrating more components on PCBs. Nevertheless, market growth is likely to be restricted with the system-on-chip design complexities.

The United States represents the largest regional market for electronic thermal management worldwide, as stated by the new market research report on Electronic Thermal Management. The market declined noticeably during the recession period. However, the US electronic thermal management market is expected to cash in on the rising complexities associated with board level packaging as well as with miniaturization of components. Power densities continue to rise unabated at board level package, resulting in demand for powerful and efficient thermal management products. Hardware products such as heat sinks and thermoelectric coolers, and software for designing these products would be the key beneficiaries. Asia-Pacific represents the second largest market for electronic thermal management. Registering a CAGR of more than 5.0% over the analysis period, the region also represents the fastest growing market for electronic thermal management. Hardware category constitutes the largest product segment, while software is poised to demonstrate fastest growth with a CAGR of more than 7.0% through 2015.

By end-use, Computers represents the largest end-use segment. On the other hand, the application of electronic thermal management solutions is projected to demonstrate fastest growth in Medical/Office Equipment with a CAGR of more than 8.0% over the analysis period.

Providing thermal management systems in electronics is becoming more complicated, with more and more miniature sized components in tight packages with high power output coming into use. Thermal management for cooling such products requires the device design to be aligned in parallel form with the design of the electronic product. The techniques used in the thermal modules effectively predict the thermal behavior of a product and helps in the electronic component designing at a great saving in cost for optimal thermal performance. The computational fluid dynamics (CFD) modeling simulations facilitate designing of the product allowing for convective heat transfer and airflow. The CFD simulations provide an indication of the heat distribution at various points in the device such as components, system and board level.

Major players profiled in the report include II-VI Incorporated, Aavid Thermalloy LLC, Advanced Thermal Solutions Inc., Alcoa Inc., Alpha Technologies Group Inc. Ametek Inc., Amkor Technology Inc., Ansoft Corporation, Ansys Inc., ASAT Holdings Ltd., Brush Engineered Materials Inc., Chomerics, Cookson Electronics Assembly Materials, C-Therm Technologies Ltd., CTS Corporation, Daat Research Corp., Dow Corning Corporation, Dynatron Corporation, Enertron Inc., Fluent Inc., Fujikura Ltd., Henkel Loctite Corporation, Honeywell Electronic Materials, ITW Vortec, Kyocera Corporation, Laird Technologies, Liebert Corporation, Lord Corporation, Lytron Incorporated, Mentor Graphics Corporation, Orient Semiconductor Electronics Ltd., PC Power & Cooling Inc., Sumitomo Electric Industries Ltd., The Bergquist Company, The Filter Factory Inc., Thermacore, United Thermal Engineering Corporation, Vette Corp., Wakefield Thermal Solutions Inc, among others.

The report titled “Electronic Thermal Management: A Global Strategic Business Report” announced by Global Industry Analysts, Inc. provides a comprehensive review of the electronic thermal management markets, impact of recession on the markets, current market trends, key growth drivers, product overview, recent product introductions, recent industry activity, and profiles of major/niche global as well as regional market participants. The report provides annual sales estimates and projections for electronic thermal management market for the following geographic markets – US, Canada, Japan, Europe, Asia-Pacific, and Rest of World. Key product segments analyzed include Hardware, Software, and Interfaces & Substrates. Key end-use segments analyzed include Computers, Telecom, Medical/Office Equipment, Industrial/Military, Consumer Electronics, and Automotive. Also, a six-year (2001-2006) historic analysis is provided for additional perspective.

For more details about this comprehensive market research report, please visit –

About Global Industry Analysts, Inc.
Global Industry Analysts, Inc., (GIA) is a reputed publisher of off-the-shelf market research. Founded in 1987, the company is globally recognized as one of the world’s largest market research publishers. The company employs over 800 people worldwide and publishes more than 1200 full-scale research reports each year. Additionally, the company also offers thousands of smaller research products including company reports, market trend reports, and industry reports encompassing all major industries worldwide.

Global Industry Analysts, Inc.
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