Dallas, Texas (PRWEB) October 09, 2012
The report provides a temporary wafer bonding equipment forecast which shows that 10% of the total thin wafer shipment will experience a temporary bonding step by 2017. So, while temporary bonding equipment is still a small market today, it is expected to grow as the need for thin wafer handling grows. In fact, we estimate the market for temporary bonding tools to be more than $250M by 2017. Currently, shipped bonder/debonders are for Power and 3D ICs applications. However, we believe 3D ICs will become the predominant application for temporary bonders > 2015.
This report describes why thinner wafers will be needed in the future, especially for consumer applications. Indeed, consumer electronics is a big driver for smaller, higher-performing, lower-cost device configurations for use in various applications, such as memory and wireless devices. These new configurations, in turn, are pushing demand for thin (< 100 µm) and even ultra-thin semiconductor wafers (below 40µm) with the following benefits:
- Reduced thickness and thus thinner packages (in cell phones, packaged dies must be < 1.2mm thick; this number shrinks to1mm for smart phones)
- Wafer thinning is the most efficient approach used for heat dissipation in thermal management
- For 3D integration, thin wafers bring higher through Si vias density, as pitch and dimensions are becoming smaller
However, as wafer thickness decreases to 100µm and below, manufacturing challenges arise. Ultra-thin wafers are less stable and more vulnerable to stress, and the die can be prone to breaking and warping—not only during grinding but also during subsequent processing steps. Yole Développement’s report describes why special thin wafer handling processes (i.e. temporary bonding) are necessary, especially when wafers are dual-side processed or have high topographies.
This report deals not only with the thin wafers market and applications, but also with related processes, equipment, and materials for temporary bonding.
CURRENTLY LOW IN VALUE, THE TEMPORARY BONDING EQUIPMENT MARKET WILL REACH US$250M BY 2017
Thin wafer handling will enjoy increased importance in the coming years, but as chips get thinner and wafer diameter increases, thinning/handling procedures are required. This implies development in wafer thinning, wafer dicing and wafer temporary bonding.
Temporary bonding implies know-how in process and chemistry, and an understanding of the final application requirements. Temporary bonding is a complex technology, requiring an interface material (sometimes called the “Magic” material) that is strong enough to withstand post-processing but which can be easily removed afterwards. As the main concern for temporary bonding materials (wax, tape or glue) is temperature stability, the material must be strong enough to withstand processing steps (metallization, etching, grinding). Another issue is the choice of carrier material. Carrier lifetime depends on its capability to withstand steps such as grinding, etc., and carrier lifetime should be at least tens of times, though this is not yet the case today.
OBJECTIVES OF THE REPORT
Provide an understanding of the thin wafers application:
- Overview of thin wafers applications: MEMS, CMOS Image Sensors, Memory, Power
Devices, RF Devices, LEDs, Interposers, Photovoltaics
- Thin wafers roadmap
Present market forecasts for thin wafers:
- 2011-2017 Market Forecast in units and US$ for thin wafers
- Detailed forecasts by application, wafer size and thickness
Analyze wafer thinning trends, with a focus on temporary bonding
Market Forecasts for temporary bonding in US$ value and number of equipment:
- By application
- By wafer size
Market Forecast for temporary bonding chemistry Overview of the different temporary bonding approaches, i.e.:
- Without carrier:
- DoubleCheck Semiconductors
- With Carrier:
- UV laser released
- Thermal release
- Mechanical release
- Chemical release
- Temporary bonding trends
- Thinning trends
- Dicing trends
- Description of the applications for temporary wafer bonding, including main characteristics and challenges
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1366 Technologies, 3M, AAC, ABB, Accretech, ADI, AGC, ALSI, Altera, AMAT, AMD, Amkor, Ampulse, ANJI, Aptina / Micron, ASE, AstroWatt, Avago, Brewer Science, Cabot, Canon, Corning, Cree, Crystal Solar, Dalsa, Danfoss, Discera, Disco, Dongjin, DoubleCheck Semiconductors, Dupont, Dynatex, Ebara, EM Marin, Epistar, Epoxy Technologies, ERS, ESI, EVG, Fairchild, Fraunhofer IZM, Freescale, GCL Solar, Hamamatsu, Hitachi Chemical, Hynix, IBM, Imec, Infineon, Intel, International Rectifier, Invensense, Ipdia, LDK, Leti, LG Innotek, Lintec, Lumileds, MEMC, Micron, Misui Chemical, Mitsubishi Electric, Nichia, Nitronex, Nitta Corp., Nitto Denko, Okamoto, Omnivision, ON Semi, Osram, Panasonic, PlanOptik, Protec, Qualcomm, REC, Renesas, ReneSola, RFMD, Robert Bosch, Roockwood, S’Tile, Samsung, SanRex, Schott, Sensonor, Seoul Semiconductor, Shinko, Sigen, Silex, Skyworks, Solarforce, SPIL, STMicroelectronics, Strasbaugh, STATSChipPAC, Sumitomo Chemical, SUSS MicroTEC, Synova, Taiko, Tekcore, TEL, TMAT, TOK, Toyoda Gosei, Triquint, Twincreeks, VisEra, WLCSP, Xilinx, Xintec, Yushin.
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