Our partnership with Vertical Circuits allows Aptos to continue to deliver leading high density, low cost stacked memory components
SCOTTS VALLEY, Calif. (PRWEB) July 29, 2008
Vertical Circuits technology provides a low cost alternative to existing stacked die wire bond and through silicon via (TSV) interconnect solutions. The VIPTM process enables IC assemblers such as Aptos to deliver very cost effective stacked semiconductor die packages that maximize silicon density and minimize the package form factor.
"Aptos has demonstrated world class capability and quality in delivering high density memory package assembly and test services," said Sunil Kaul, CEO & President of Vertical Circuits. "The combination of Aptos's extensive assembly experience for the world's leading flash memory providers and VCI's low cost VIPTM technology enables us to offer an immediate, high volume manufacturing solution to our growing customer base. We believe this partnership will further advance our ability to establish VCI's VIPTM as the new standard interconnect solution for high density memory components."
"Our partnership with Vertical Circuits allows Aptos to continue to deliver leading high density, low cost stacked memory components," said Daniel Jow, Chairman of Aptos. "The proven VIPTM technology seamlessly integrates into our existing high volume manufacturing lines and enables us to bring the technology to the market in a very short time. We are excited with this partnership and look forward to a long and mutually beneficial relationship with VCI."
Vertical Circuits has licensed its VIPTM technology to leading global device manufacturers and packaging companies based in the US, Japan, and Taiwan. The VIPTM technology is ideally suited for high capacity removable, as well as embedded, flash memory applications, including a broad array of memory cards, USB memory, and emerging SSD products. In addition, the low inductance, high performance, characteristics of the VIPTM conductors also make them well suited for DDR2/3 modules, memory / logic device stacks, and specialty device applications.
About Vertical Circuits, Inc.
Vertical Circuits Inc., a global supplier of advanced die level vertical interconnect technology, products, services and intellectual property for the manufacture of low cost, ultra high-speed/high-density semiconductor components. Vertical Circuits licenses its VIPTM technology to leading IC manufacturing and packaging companies and is headquartered in Scotts Valley, CA. For more information, visit http://www.verticalcircuits.com
About Aptos Technology, Inc.
Aptos Technology Inc., a major supplier of advanced memory packaging house which focus on high density, multi-layers stacking MCP and SIP by utilizing its ultra thin wafer technology. Aptos provides its packaging and testing service with outstanding performance to global Tier1 OEM customers. Aptos is headquartered in Miaoli, Taiwan. For more information, visit http://www.aptostech.com
CONTACT AT VERTICAL CIRCUITS INC: Yin Chang Vertical Circuits Inc. Tel: +1.831.438.3887 x102 Email: email@example.com
International Offices: U.S.A.: 10 Victor Square, Scotts Valley CA 95066 +1.831.438.3887 Taiwan: +886.938.637377 CONTACT AT APTOS TECHNOLOGY INC.: Howard Fu Aptos Technology Inc. Tel: +886.37.586068 x3300 Email: firstname.lastname@example.org
International Office: Taiwan: No.398, Youyi Rd, Jhunan Township, Miaoli County