VCI's VIPTM technology provides a more cost-effective and high-yield solution for interconnecting stacked die by using Asymtek's proven jetting capabilities
SCOTTS VALLEY, Calif. (PRWEB) July 15, 2008
Vertical Circuits' patented vertical interconnect pillar (VIPTM) technology provides a low-cost alternative to existing wire bond and emerging through silicon via (TSV) interconnect solutions. The VIPTM solution enables IC manufacturers to deliver cost-effective stacked semiconductor die solutions that maximize the silicon density and minimize the package form factor. VCI's VIPTM conductors are dispensed on the edge of the die stack utilizing Asymtek's high speed, high accuracy jetting technology on the Axiom® dispenser.
"It has been a pleasure to work with the world leader in precision electronic material dispensing," said Simon McElrea, Vertical Circuits' vice president of product development. "By leveraging Asymtek's proven fluid-jetting technology, originally developed for flip chip applications and incorporated into Asymtek's Axiom® platform, we have been able to offer a plug-and-play, VCI VIPTM ready, solution to our manufacturing partners. The simple user interface, patented fluid control features and proven equipment reliability are exemplary in our industry. The Axiom® solution makes the adoption of our technology into existing assembly lines seamless and straight forward."
"VCI's VIPTM technology provides a more cost-effective and high-yield solution for interconnecting stacked die by using Asymtek's proven jetting capabilities," comments Alec Babiarz, president, new business development, Asymtek. "Asymtek and other equipment partners are well positioned to provide customers the global service and support they require. We look forward to more industry adoption of the VIPTM technology."
Vertical Circuits has licensed its VIPTM technology to leading global device manufacturers and packaging companies. The technology is ideally suited for high capacity removable, as well as embedded, flash memory applications, including a broad array of memory cards, USB memory, and emerging SSD products. In addition, the low inductance, high performance, characteristics of the VIPTM conductors also make them well suited for DDR2/3 modules, memory / logic device stacks, and specialty device applications.
Vertical Circuits and Asymtek will be displaying the VIPTM interconnect technology and polymer jetting tool solution at SEMICON West, being held at Moscone Center in San Francisco, July 15-17, 2008, booth #7115.
About Vertical Circuits, Inc.
Vertical Circuits Inc., is a global supplier of advanced die level vertical interconnect technology, products, services and intellectual property for the manufacture of low cost, ultra high-speed/high-density semiconductor components. Vertical Circuits licenses its VIPTM technology to leading IC manufacturing and packaging companies and is headquartered in Scotts Valley, CA. For more information, visit http://www.verticalcircuits.com.
Asymtek®, a world leader in automated fluid dispensing, conformal coating, and jetting technologies, designs and manufactures a full line of dispensing and coating systems, supported by a global applications and service network. Recognized for its innovative equipment and excellent service, Asymtek continues to offer advanced applications for a range of industries. These include semiconductor packaging, printed circuit board assembly, LEDs, flat panel display assembly, automotive, medical/biotech product assembly, and other precision assembly processes. Founded in 1983 and acquired in 1996 as a subsidiary of Nordson Corporation, Asymtek is an ISO 9001:2000 certified company. Asymtek has received numerous awards including Intel's prestigious Supplier Continuous Quality Improvement award for five years in a row: 2003, 2004, 2005, 2006 and 2007. For more information, visit http://www.asymtek.com.
Nordson Corporation is one of the world's leading producers of precision dispensing equipment that applies adhesives, sealants, and coatings to a broad range of consumer and industrial products during manufacturing operations. The company also manufactures equipment used in the testing and inspection of electronic components as well as technology-based systems for curing and surface treatment processes. Headquartered in Westlake, Ohio, Nordson has more than 4,100 employees worldwide, and direct operations and sales support offices in 30 countries. For more information, visit: http://www.nordson.com
CONTACT AT VCI: Yin Chang Vertical Circuits Inc. Tel: +1-831-438-3887 x102 Email: firstname.lastname@example.org
International Offices: U.S.A.: 10 Victor Square, Scotts Valley CA 95066 +1.831.438.3887 Taiwan: +886-938-637377 CONTACT AT ASYMTEK: Roberta Foster-Smith Asymtek, A Nordson Company Tel: +1-760-431-1919 Email: email@example.com
International Offices: U.S.A.: 2762 Loker Ave. West, Carlsbad CA 92010 +1.760.431.1919 Europe: +31 (0) 43-352-4466 S.E. Asia: +65 6796 9500 Japan: +81 (0) 3-5762-2801 Taiwan: +886-2-2902-1860 Korea: + 82-31-765-8337 China: +86-21-3866-9166