YES equipment significantly streamlines the WLP process.
Livermore, CA (PRWEB) December 19, 2012
Yield Engineering Systems, Inc. (YES), a wafer-level packaging (WLP) process equipment manufacturer, announced today that they have written a new whitepaper discussing the importance of using a polyimide vacuum curing system instead of an atmospheric oven for successful Redistribution Layers (RDL). It was recently featured on Semiconductor Packaging News. The full whitepaper can be obtained online at http://www.yieldengineering.com/wlp.
“Superior Polymer Processing for Wafer-level Packaging” explains that an integral part of WLP involves the relocation of the Input/Output (I/O) pads used to communicate with the die to points suitable for the final package. The pads can be relocated using RDL.
YES manufactures a variety of equipment including tools for WLP type processes with a low-cost of ownership. The YES-VertaCure Series and the YES-450PB Series use high temperature to achieve wafer dehydration, oxygen removal and solvent outgassing. These processes are vital to the success of wafer-level packaging.
“YES equipment significantly streamlines the WLP process,” says Bill Moffat, CEO and Founder, “We understand engineer’s WLP issues and have created a viable solution.”
For more information regarding the YES-VertaCure or YES-450PB, visit http://www.yieldengineering.com or contact them toll free in the USA or Canada at 888-937-3637 or worldwide at +1-925-373-8353.
About Yield Engineering Systems, Inc.
YES was founded in 1980, and is headquartered in Livermore, California, USA. They provide quality process equipment for semiconductor, WLP, photovoltaic, FPD, MEMS, medical, nanotech industries and more.
They manufacture high temperature vacuum cure ovens, chemical vapor deposition (CVD) systems, plasma etch and clean tools used for precise surface modification, surface cleaning, and thin film coating of semiconductor wafers, semiconductor and MEMS devices, biosensors and medical slides.