Suzhou, China (PRWEB) June 22, 2012
Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced today it has received Microsemi Corporation’s Outstanding Supplier award in recognition of quality, on-time deliveries, technical support and service. The award is based on a rating system which ranked Carsem Suzhou top amongst Microsemi’s subcontractors in Asia.
During a recent ceremony held at the Carsem Suzhou factory on May 24, 2012, the award was presented by Kelly Jones, Microsemi Corporation’s Senior Vice President of Corporate Operations, to T.W. Hee, Carsem Suzhou General Manager. Also in attendance were Albert Law, Carsem’s Vice President of Worldwide Sales and Marketing, WS Kee, Director of Sales, China and Carsem Suzhou’s management team.
“We are pleased to once again present Carsem with our Outstanding Supplier award in recognition of Carsem’s service, delivery performance, and consistently high quality over the past year” said Jones. “Carsem has been a key assembly and test provider for Microsemi and an important link in our supply chain for several years. We look forward to an ongoing relationship as we continue to grow our business.”
“Microsemi has one of the highest standards in areas of quality, delivery and overall service expectations in the industry. Besides the need for outstanding overall performance indices, another key element is consistency. A subcontractor needs to consistently be in a top position to win this award. Carsem Suzhou is very proud to once again be the recipient of this award from Microsemi,” stated Mr. Hee, Carsem Suzhou General Manager.
Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest ranges of package & test portfolios in the world. To meet the growing demands of the telecommunications and wireless markets for smaller, faster, thermally-efficient devices, Carsem’s portfolio includes several advanced technologies, such as the Micro Leadframe Package (MLP), Flip Chip On Leadframe (FCOL), and a SiP (System-in-Package) capability. Carsem also offers a full range of turnkey test services for RF, mixed-signal, linear, digital and power devices. Our factories maintain world-class quality standards having achieved SAC Level 1, ISO-9001, ISO-14001, QS-9000, TS16949 certifications, and are supported with a global network of sales and engineering support offices. Carsem is a member of the Hong Leong Group with factories located in Ipoh, Malaysia, Suzhou, China and sales offices across the USA, plus the UK and Taiwan. Carsem, Inc. sales headquarters is located at 269 Mt. Hermon Road, Suite 104, Scotts Valley, CA 95066, phone (831) 438-6861, fax (831) 438-6863, web site: http://www.carsem.com.
Microsemi Corporation offers a comprehensive portfolio of semiconductor and system solutions for communications, defense and security, aerospace, as well as industrial and medical markets. Products include mixed-signal integrated circuits, SoCs and ASICS; programmable logic solutions; power management products; timing and voice processing devices; RF solutions; discrete components; and Power-over-Ethernet ICs and midspans. Microsemi is headquartered in Aliso Viejo, Calif., and has approximately 3,000 employees globally. Learn more at http://www.microsemi.com.