Cave Creek, AZ (PRWEB) March 13, 2013
The High Density Packaging Users Group (HDP) headquartered in the United States announces that Sekisui Corporation has become its newest member.
Sekisui Chemical Co., Ltd. is a premier materials supplier to the global LCD and Semiconductor, markets. Sekisui has developed and markets a plastic core solder ball known as Micropearl SOL, which is widely used in various package applications. Other products include solder materials, conductive fine particles, intermediate films for laminated glass, foamed polyolefin, double-faced tapes, industrial resins and films, optical films, inspection chemicals, medical equipment, packing tapes, adhesives and plastic containers.
Hiroya Ishida Assistant Mgr. for Sekisui said “We are keen to provide highly reliable solder materials based on our key polymer particle technologies and contribute to packaging innovation by participating in HDP user group projects.”
Marshall Andrews Executive Director of HDP user group said “We are excited to have Sekisui Chemical as a new member. Sekisui will contribute significantly to our electronics assembly programs.” HDP user group has five programs which target the use of new environmentally friendly soldering materials. The new polymer ball project provides a replacement for toxic lead materials with a polymer material that has better mechanical properties. This new approach is targeted at improving reliability and providing a green solution for electronics we all use in our daily lives.
About Sekisui Chemical Co., LTD.
Sekisui Chemical Co., Ltd. was founded in 1947 and is headquartered in Osaka, Japan, and Sekisui currently has three main business segments: Housing, Urban Infrastructure & Environmental Products and High-performance Plastics segment. Sekisui is a global leading supplier of chemical products.
For more information, visit Sekisui on the Internet at http://www.sekisuichemical.com.
About HDP User Group
HDP User Group (http://www.hdpug.org) is a global research and development organization based in Scottsdale AZ, dedicated to “reducing the costs and risks for the Electronics Manufacturing industry when using advanced electronic packaging and assembly”. This international industry led group organizes and conducts R&D programs to address the technical issues facing the industry, including design, printed circuit board manufacturing, electronics assembly, and environmental compliance. HDP User Group maintains additional offices in Austin, Texas; Stockholm, Sweden; and Tokyo, Japan.
For more information, visit HDP User Group on the Internet at http://www.hdpug.org
or contact Darryl Reiner at darrylr(at)hdpug(dot)org, phone number +1 480-951-1963