The Global 3D IC market is expected to grow at a CAGR of 19.7% over the period 2012-2016
Dublin, Ireland (PRWEB) March 19, 2013
According to the report, the Global 3D IC market is forecast to grow at a CAGR of 19.7 percent over the period 2012-2016. One of the major growth drivers is the increasing demand for 3D ICs in memory products (flash memory and DRAM). 3D ICs are able to improve the performance and reliability of memory products and can also help reduce their cost and size. The Global three-dimensional integrated circuit market has also been witnessing the increase of multi-chip packaging. However, the thermal conductivity issues could pose a challenge to the growth of this market.
This market research report is based on an in-depth analysis exclusively covering the Americas, and the EMEA and APAC regions. The report aims to aid decision makers' understanding of the significant trends impacting the market.
The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. It contains a comprehensive market and vendor landscape in addition to a SWOT analysis of the key vendors.
The key vendors dominating the 3D IC market space are Advanced Semiconductor Engineering Co. (ASE), Samsung Electronics Co. Ltd., STMicroelectronics N.V., and Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC).
The other vendors mentioned in the report are Elpida Memory Inc., IBM Corp., Intel Corp., and Micron Technology Inc.
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