Dallas, TX (PRWEB) January 30, 2014
After two years of recession, the semiconductor equipment market is projected to achieve growth in 2014. In 2011, the semiconductor equipment market size hit a record high of USD43.532 billion, but it witnessed a drop by 15.2% in 2012 and a further decline by 8.1% in 2013. The reduction came mainly as the steep decrease of backlog orders from North America and South Korea. Notably, the contracted orders from North America resulted largely from the glooming PC market and Intel’s reduction of capital expenditure for equipment, while the shrinkage of orders from South Korea was heavily duel to the suspension of investment in DRAM.
In 2014, the driving force of the semiconductor equipment market is mainly sourced from foundry and memory. In particular, foundry began to step into 20nm domain, while memory is ushering in 3D era. In the era of 20nm, semiconductor vendors employ two routes: double/multiple patterning and EUV. Double/multiple patterning is more technologically advanced than EUV, although it means substantial cost rise in manufacturing and equipments, especially for etching equipments.
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EUV can cut the manufacturing and equipments cost significantly, albeit EUV itself costs as high as USD100 million. But counted by the total cost, 14nm wafer equipped with EUV technology is roughly 40% lower than that equipped with multiple patterning technology. However, there are many hurdles for EUV remained to be addressed. One of them is light source. Multiple e-beam direct write is well low-efficiency, thus failing to meet the standard for practical use.
Equipment vendors have failed to catch up with the development of foundry, especially the ASML which almost monopolize the global lithography market, so foundry will have to slow down their pace towards advanced node. The cost of multiple patterning may be OK for customers, but it is not the case when it comes to the cost of triple patterning. Nevertheless, this cannot prevent industrial players from making continued research, so the procurement of equipments still keeps growing.
The semiconductor equipment industry is experiencing ceaseless integration. Take Applied Material for example, it took over second-ranked Tokyo Electron in 2013, further consolidating its position with the market occupancy in the etching market on a big rise.
Taiwan became the largest semiconductor equipment market. Taiwan-based industrial players such as TSMC and UMC make bulk buying of advanced equipments. The estimate shows that Taiwan semiconductor equipment market size will bag USD10.99 billion by 2014 and that the figure by 2015 will slightly decline to USD10.88 billion.
Few Points from Table of Contents
List of Charts
Quarterly Revenue of Global Semiconductor Industry, 2009-2014
Yearly Revenue of Global Semiconductor Industry, 2008-2017E
Product Distribution of Global Semiconductor Market, 2012-2017E
Market Size and Growth Rate of Various Semiconductor Products, 2012-2017E
Global Semiconductor Equipment Capital Expenditure, 2008-2017E
Downstream Distribution of Global Semiconductor Equipment Capital Expenditure, 2008-2017E
CAPEX of DRAM Industry, 2000-2012
Global DRAM Shipment, 2000-2013
Change of DRAM Contract Price, Oct 2009-Jan 2012
Revenue of Global DRAM Vendors, Q1 2005-Q4 2012
Global DRAM Wafer Shipment, Q1 2010-Q4 2012
System Memory Demand, 2001-2013
Revenue Ranking for Branded DRAM Vendors, Q4 2011-Q3 2013
Revenue Ranking for Branded Mobile DRAM Vendors, Q3 2013
Sales Ranking of Branded NAND Flash Makers, Q4 2011-Q3 2013
Global Foundry Market Size, 2008-2017E
Foundry Revenue of Advanced Nodes, 2012-2017E
Capacity of Top 10 Global Foundries, 2013
Sales Ranking of Global Foundries, 2005-2011
Global IC Packaging and Testing Market Size, 2012-2017E
Global Outsourced IC Packaging and Testing Market Size, 2012-2017E
Global IC Packaging Market Size, 2012-2017E
Global IC Testing Market Size, 2012-2017E
Revenue of Taiwan's IC Packaging and Testing Industry, 2009-2013
China’s Semiconductor Market Size, 2010-2015E
China’s IC Market Size, 2010-2015E
China’s Discrete Semiconductor Device Market Size, 2010-2015E
China’s IC Import Value, 2006-2013
China’s IC Export Value, 2006-2013
Revenue and Profit of 20 Global Listed Semiconductor Equipment Enterprises, Q1 2000-Q3 2013
Geographical Distribution of Semiconductor Capital Expenditure, Q1 2000-Q3 2013
Semiconductor Equipment Market Size, 2010-2016E
Geographical Distribution of Semiconductor Equipment Market Size, 2010-2015E
Global Wafer Equipment Investment, 2007-2016E
Capital Expenditure of Global Top 10 Semiconductor Vendors, 2012-2013
Geographical Distribution of Global Wafer Equipment Expenditure, 2010-2012
Semiconductor Materials Market by Region, 2004-2014
Wafer Fabrications Materials Market by Region, 2013
Etching Market by Solution, 2008-2012
Market Share of Major Etching Equipment Vendors, 2000\2005\2010\2013
Market Share of Major Global CVD PVD ECD CMP Vendors, 2000\2005\2010
Deposition Market by Solution, 2008-2012
Deposition Market Share, 2012
Market Share of Global Lithography Equipment Vendors, 1992-2011
Growth Rate of Semiconductor Process Control Equipment Market, 1995-2012
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