AIM Solder Brings New Low-Cost Lead-Free Solder Paste and VOC-Free Liquid Flux to Productronica 2013

AIM Solder, a leading global manufacturer of assembly materials for the electronics industry, announces that the company will highlight two newly developed and award-winning products, lead-free NC259 Solder Paste and VOC-free NC277 Liquid Flux, in Hall A2 Booth 540 at Productronica 2013, November 12– 15th in Munich, Germany.

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Visit Us in Stand A2/540 at PRODUCTRONICA Nov. 12-15th

Visit AIM in Hall A2 Booth 540

Cranston, Rhode Island (PRWEB) October 01, 2013

AIM Solder, a leading global manufacturer of assembly materials for the electronics industry, announces that the company will highlight two newly developed and award-winning products, lead-free NC259 Solder Paste and VOC-free NC277 Liquid Flux, in Hall A2 Booth 540 at Productronica 2013, held November 12th – 15th in Munich, Germany.

AIM’s new halogen-free solder paste is a low cost lead-free solution that offers the performance of tin/lead and high-silver, lead-free solder pastes minimizing post-process residues and graping. NC259 is formulated to provide one of the longest pause-to-print windows in the industry, resulting in far less solder waste, fewer restart costs and improved overall print quality. Proven to mitigate head-in-pillow defects, NC259 reduces rework and rejected board costs allowing manufacturers to attain the SMT soldering results they require while paying significantly less per gram than with traditional lead-free solder pastes.

NC277 is a VOC-free liquid flux that is as electrically safe as an alcohol-based flux that is suitable for long thermal demands. This flux can withstand the high thermal preheats and provides a broad activation range, proving to be an excellent flux for a variety of process parameters and applications, including lead-free wave soldering with tin-silver-copper, tin-silver, tin-copper, and other alloys. In addition, NC277 offers medium post-process residues and has shown to reduce preventative maintenance requirements for spray fluxing applications.

Additionally, AIM will feature its liquid fluxes, tin/lead and lead-free alloys, including SN100C. SN100C is a lead-free solder alloy developed by Nihon Superior in Japan that is comprised of tin, copper, and a small amount of nickel + germanium. To discover all of AIM’s products, visit the company in stand A2/540 or visit http://www.aimsolder.com.

About AIM
Headquartered in Montreal, Canada, AIM Solder is a leading global manufacturer of assembly materials with manufacturing, distribution and support facilities located throughout the world. AIM produces advanced solder products such as solder paste, liquid flux, cored wire, bar solder, epoxies, lead-free and halogen-free solder products, preforms, and specialty alloys such as indium and gold for a broad range of industries. A recipient of many prestigious SMT industry awards, AIM is strongly committed to innovative research and development of product and process improvement as well as providing customers with superior technical support, service and training.

Upcoming Events:
October 9, 2013 - SMTA Long Island Islandia Marriott Long Island, Islandia, NY USA    
October 15-16, 2013 – SMTA International Fort Worth Convention Center, Fort Worth, TX USA
October 22, 2013 - SMTA Connecticut Chapter Waterbury Marriott, CT USA    
November 12-15, 2013 – Productronica Messe München, Munich, Germany


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