Intelligent Implant Systems Announces Allowances of US and International Implant and Instrumentation Patents

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Continuing to innovate, and bringing new technologies to market, Intelligent Implant Systems is pleased to announce that two patents covering new implants and instrumentation have been allowed.

Intelligent Implant Systems, LLC, a recognized innovator in the treatment of spine disorders and the development of spinal implant technology, announced today that it received Notice of Allowance of claims in two patent applications which broadly cover two novel products and technologies. The first, in the United States, is for instrumentation and a surgical procedure for insertion of percutaneous implants. The second, in Japan, is for the company’s Load Sharing Interbody Fusion device.

“Our team has done an excellent job of adding superior instruments and implant technologies to our portfolio. Percutaneous access to the spine is difficult and becomes more difficult when increasing levels of the spine need to be treated. Our new instrument simplifies the procedure and allows a variety of options for the surgeon not available in other systems. The Load Sharing Interbody Fusion Device is the first interbody fusion implant of its kind, and is designed to share loads in the spine with the implant and graft to assist in fusion. We will be introducing both of these products to the market in the near future,” according to Marc Richelsoph, President and CEO.

Intelligent Implant Systems, LLC has numerous patents issued and pending in the U.S. and globally, and will be showing a series of products at the upcoming North American Spine Society meeting , next week in New Orleans. For more information, please contact Michael Nutt at 704-424-1009 or visit http://www.intelligentimplantsystems.com.

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Kelly Richelsoph
kelly@intelligentimplantsystems.com
7044241009
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