(PRWEB) October 22, 2013
Featuring the combination of electrical insulation properties and thermal conductivity, Master Bond Supreme 3HTND-2GT can be used for a variety of applications including bonding, sealing, glob top and die attach. This toughened epoxy system bonds well to a wide variety of substrates used in electronics, including metals, composites, ceramics and many plastics.
As a one component system, Supreme 3HTND-2GT does not require mixing and features a thicker viscosity with limited flow characteristics. Unlike many epoxies it can be readily and efficiently applied to a defined area. It cures quickly in 20-30 minutes at 250°F or in 5-10 minutes at 300°F with very low shrinkage. Supreme 3HTND-2GT can cure in thicknesses of up to 1/8 inch if needed.
Additionally, this dimensionally stable system is capable of withstanding rigorous thermal cycling and shocks. Thermally stable, the service temperature range for this system is first rate at -100°F to +400°F. It resists chemicals rather well, including water, acids, bases and many solvents. Particularly noteworthy is its low level of ionic impurities.
Supreme 3HTND-2GT is yellowish tan in color and is available in a variety of packaging including syringes, cartridges, pints, quarts and gallon containers.
Master Bond Toughened Epoxy Compounds
Master Bond Supreme 3HTND-2GT is a multifunctional system for glob top, die attach, bonding and sealing applications featuring thermal conductivity, high temperature resistance and toughness. Read more at http://www.masterbond.com/properties/flexibilized-and-toughened-adhesive-systems or contact Tech Support. Phone: +1-201-343-8983 Fax: +1-201-343-2132.