Orbotech Presents Advanced Technologies for HDI and IC Substrate Production

Orbotech is demonstrating advanced technologies for creating a new PCB world at the TPCA Show in Taipei, Taiwan - Hall 4F, Booth #L924.

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Orbotech, AOI, Ultra Fusion

Ultra Fusion™ 600 AOI System

“Orbotech’s latest solutions...can help our customers to be more competitive by enabling them to produce finer products in higher yield and at higher throughput.” - Mr. Arik Gordon, President of Orbotech Pacific Ltd.

Taipei, Taiwan (PRWEB) October 23, 2013

Orbotech Pacific Ltd., the Asia Pacific subsidiary of Orbotech Ltd., a leading global provider of yield-enhancing and production solutions for printed circuit boards (PCBs) and IC substrates, is demonstrating advanced technologies for creating a new PCB world in Hall 4F, Booth #L924 at the TPCA Show in Taipei, Taiwan.

“The PCB market is becoming more competitive as many manufacturers of traditional MLB products are moving into production of HDI, and HDI makers are investing in production lines for IC substrates”, said Mr. Arik Gordon, President of Orbotech Pacific Ltd. “Orbotech’s latest solutions are targeting these advanced applications, where we can help our customers to be more competitive by enabling them to produce finer products in higher yield and at higher throughput.”

Being introduced for the first time worldwide at TPCA is Orbotech’s new Ultra Fusion™ 600 automated optical inspection (AOI) system featuring advanced performance with high speed for IC substrates production down to 5μm.

Also being presented for the first time in Asia Pacific is Orbotech’s new Paragon™-Xpress 50 laser direct imaging (LDI) system for mass production digital imaging of fine line HDI, flex and rigid-flex applications down to 15um line/space. Other demonstrations by Orbotech at the show include Ultra PerFix™ 120 automated optical repair (AOR) system for repairing shorts and excess copper on advanced HDI and IC substrates including CSP, FC-CSP, BGA and FC-BGA applications. Ultra PerFix™ 120 minimizes scrap by achieving perfect results in less than a minute on challenging designs with a resolution down to 10μm. The Sprint™ 120 inkjet printer with DotStream Technology™ delivers high speed and top quality for consistent, volume production of advanced legend designs. Sprint systems now include new capabilities for printing on flexible PCBs with Taiyo flex ink. The latest developments from Frontline PCB Solutions are on display including InCAM®, the leading CAM system for HDI and IC packaging, and InSight PCB®, the fast and accurate web-based pre-CAM solution.

About Orbotech Ltd.

Orbotech Ltd. (NASDAQ/GSM: ORBK) has been at the cutting edge of the electronics industry supply chain, as an innovator of enabling technologies used in the manufacture of the world’s most sophisticated consumer and industrial products, for over 30 years. The Company is a leading provider of yield-enhancing and production solutions, primarily for manufacturers of printed circuit boards, flat panel displays and other electronic components; and today, virtually every electronic device is produced using Orbotech technology. The Company also applies its core expertise and resources in other advanced technology areas, including character recognition for check and forms processing and solar photovoltaic manufacturing. Headquartered in Israel and operating from multiple locations internationally, Orbotech’s highly talented and inter-disciplinary professionals design, manufacture, sell and service the Company’s end-to-end portfolio of solutions for the benefit of customers the world over. For more information please see the Company’s filings with the U.S. Securities and Exchange Commission at http://www.sec.gov and visit the Company’s corporate website at http://www.orbotech.com. The corporate website is not incorporated herein by reference and is included as an inactive textual reference only.


Contact

  • Michelle Harnish, Marketing Communications Project Manager
    Orbotech Ltd.
    +1 (603) 289-7937
    Email