AIM’s International Technical Support Manager, Carlos Tafoya, to Present at the IPC Conference on Solder and Reliability in Costa Mesa, CA, November 13, 2013

AIM Solder announces today that Carlos Tafoya, International Technical Application Manager, is to present “Alternative Lead-Free Alloys for SMT Assembly” at the IPC Conference on Solder and Reliability: Materials, Processes and Tests, held November 13-14th, 2013 in Costa Mesa, CA. The presentation is scheduled on Wednesday, November 13 at 3:00 pm.

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Carlos Tafoya,
International Technical Applications Manager

Carlos Tafoya, International Technical Applications Manager

Cranston, Rhode Island (PRWEB) November 07, 2013

AIM Solder announces today that Carlos Tafoya, International Technical Application Manager, is to present “Alternative Lead-Free Alloys for SMT Assembly” at the IPC Conference on Solder and Reliability: Materials, Processes and Tests, held November 13-14th, 2013 in Costa Mesa, CA. The presentation is scheduled on Wednesday, November 13 at 3:00 pm.

The intention of this paper is to investigate alternative lead-free alloys for SMT assembly and the potential successful outcomes of the implementation thereof. Tafoya discusses the chemistries of newly developed lead-free alloys and the effects they have as it relates to assembly performance. The presentation includes mechanical data and testing procedures examining the risks involved when changing alloys, including tin whisker growth, head-in-pillow mitigation, drop-shock performance and flux compatibility. This study provides valuable insight into initial alloy composition versus the alternative.

Carlos Tafoya oversees a technical applications group that supports customers throughout the United States, Mexico, Canada, Europe, China and India. Tafoya joined AIM in 2005, after more than 20 years of experience in the electronics assembly manufacturing industry where he held various positions such as SMT Process Engineer, Advanced Manufacturing Engineer, and NPI Engineer. Tafoya studied industrial and electronics engineering at the University of Wisconsin, Madison and the University of Texas, El Paso, where he graduated in 1981. He has been a member of the SMTA for 20 years where he obtained his SMT certification as a process engineer (CSMTPE). He currently serves on SMTA certification and training committees as a voluntary member.

About AIM
Headquartered in Montreal, Canada, AIM Solder is a leading global manufacturer of solder assembly materials with manufacturing, distribution and support facilities located throughout the world. AIM produces advanced solder products such as solder paste, liquid flux, cored wire, bar solder, epoxies, lead-free and halogen-free solder products, preforms, and specialty alloys such as indium and gold for a broad range of industries. A recipient of many prestigious SMT industry awards, AIM is strongly committed to innovative research and development of product and process improvement as well as providing customers with superior technical support, service and training.

To learn more about the products and services offered by AIM, please visit http://www.aimsolder.com.

Upcoming Events:
November 12-15, 2013 – Productronica Messe München, Munich, Germany
November 13-14, 2013 – IPC Conference on Solder and Reliability Costa Mesa, CA USA


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