Bergquist's Latest Gap Filler 1500LV Thermal Interface Material is Lowering the Bar on Volatility
Chanhassen, MN (PRWEB) July 08, 2013 -- The Bergquist Company is excited to introduce the first in a new line of low volatility liquid silicone gap fillers, Gap Filler 1500LV. Gap Filler 1500LV is a low volatility, two-component, liquid-dispensable thermal interface material that offers the high temperature resistance and low modulus of a silicone material with minimal outgassing. As dispensed, the material is designed to remain in place and maintain its shape on the target surface, allowing for ultimate flexibility in component orientation during assembly. Gap Filler 1500LV is thixotropic and although it will remain in place after dispensing, the material will flow easily under minimal pressure resulting in little to no stress on fragile components during assembly. As cured, this soft elastomer provides a thermal conductivity of 1.8 W/mK that is ideal for filling unique and intricate air voids and gaps. Gap Filler 1500LV is ideal for use in lighting applications or other situations where fogging of lenses or optics is a potential consideration.
Unlike precured gap filling materials, liquid dispensed materials offer infinite thickness options and eliminate the need for specific pad thicknesses or die-cut shapes for individual applications. Gap Filler 1500LV is specifically designed with shear thinning characteristics to support optimized dispensing. Applying precise amounts of material directly to the target surface results in effective use of material with minimal waste. Available in cartridge and kit form, this material is well suited for manual or automated dispensing.
About The Bergquist Company:
The Bergquist Company designs and manufactures high performance thermal management materials used to dissipate heat and keep electronic components cool. Headquartered in Chanhassen, MN, Bergquist supplies the world with some of the best-known brands in the business: Gap Pad® and Liqui-Form™ electrically insulating gap filling materials, Sil-Pad® thermally conductive interface materials, Hi-Flow® phase change grease replacement materials, Bond-Ply® thermally conductive adhesive tapes, Liqui-Bond® liquid adhesives and Thermal Clad® insulated metal substrates.
Becky Cater, The Bergquist Company, http://www.bergquistcompany.com, 952-835-2322 Ext: 6518, [email protected]
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