Chanhassen, MN (PRWEB) July 22, 2013
The Bergquist Company is excited to introduce Liqui-Bond® SA 3505, the latest member of its liquid silicone adhesive line of thermal interface materials. At 3.5 W/m-K, Liqui-Bond® SA 3505 offers a high thermal conductivity previously unavailable in a structural adhesive. Liqui-Bond® SA 3505 is a two-component, liquid silicone adhesive that is ideal for power supplies and discrete applications. Because Liqui-Bond® SA 3505 is supplied as a two-part liquid, refrigeration is not required. Heat cure is recommended to achieve ideal bond strength. Liqui-Bond® SA 3505 is thixotropic and although it will remain in place after dispensing, the material will flow easily under minimal pressure resulting in little to no stress on fragile components during assembly. As cured, this strong bonding elastomer provides excellent thermal transfer while eliminating the need for mechanical fasteners.
Unlike precured gap filling materials, liquid dispensed materials offer infinite thickness options and eliminate the need for specific pad thicknesses or die-cut shapes for individual applications. Liqui-Bond® SA 3505 is specifically designed with shear thinning characteristics to support optimized dispensing. Applying precise amounts of material directly to the target surface results in effective use of material with minimal waste. Available in cartridge and kit form, this material is well suited for manual or automated dispensing.
About The Bergquist Company:
The Bergquist Company designs and manufactures high performance thermal management materials used to dissipate heat and keep electronic components cool. Headquartered in Chanhassen, MN, Bergquist supplies the world with some of the best-known brands in the business: Gap Pad® and Liqui-Form™ electrically insulating gap filling materials, Sil-Pad® thermally conductive interface materials, Hi-Flow® phase change grease replacement materials, Bond-Ply® thermally conductive adhesive tapes, Liqui-Bond® liquid adhesives and Thermal Clad® insulated metal substrates.