Vernon Hills, IL (PRWEB) August 01, 2013
Deringer-Ney Inc. has developed a new alloy, Paliney C®, that provides increased current carrying capacity for semiconductor test probes. Deringer-Ney is a leading manufacturer of high performance precious metal alloys and parts used in a variety of industries, and their newest alloy can help improve the performance on your next laptop, tablet, or smart phone.
"Consumers demand more and more functionality from their smart phones, tablets, and PC’s. This demand is driving semiconductor manufacturers to make smaller and smaller chips," said Bruce Quimby, the Director of Marketing and Engineering at Deringer-Ney, "All these chips must be tested to ensure reliable performance. To test such small devices, semiconductor manufacturers increasingly require smaller and smaller sized probes. These probes can overheat due to the electrical current that must flow through the smaller diameters. This is why DNI developed Paliney C®."
Paliney C® was designed to provide an alternative to Paliney 7® in applications where the current carrying capacity of Paliney 7® is inadequate and can cause probe overheating. The introduction of this new material will allow probe needle suppliers to participate in applications where previously micro-electro-mechanical systems (MEMS) were the only solution. As such, Paliney C® provides a new alternative to semiconductor companies for testing of devices used in the latest computers, tablets and smart phones.
About Deringer-Ney Inc.
Deringer-Ney is a leading manufacturer of high performance precious metal alloys and parts used in semiconductor test, semiconductor fab, automotive sensing, medical device, electrical switching, and controls industries. The company employs over 350 people and has manufacturing plants in North America and Mexico. To learn more about Deringer-Ney, visit: http://www.deringerney.com/.