Heidelberg, Germany (PRWEB) August 07, 2013
Alexander Forozan, Vice President of Global Sales and Business Development at Heidelberg Instruments GmbH, will outline the roadmap for maskless aligner systems during the International Nanotechnology Conference in Beijing, China, on August 6, 2013.
For low and mid volume micro fabrication and prototyping, Maskless Aligner System offers a compelling cost of ownership advantage. The current standard process is to have a photomask made, followed by transferring the pattern to the silicon wafer using a mask aligner, a time-consuming and expensive process. A maskless aligner enables direct transfer of patterns thus eliminating the need of photomasks and traditional mask aligners, shortening the prototyping time as well as saving significant cost.
About Heidelberg Instruments, GmbH: With an installation base in over 40 countries, Heidelberg Instruments is a world leader in production of high precision maskless lithography and maskless aligner systems. These systems are used for direct writing and photomask production by some of the most prestigious universities and industry leaders in the areas of MEMS, BioMEMS, Nano Technology, ASICS, TFT, Plasma Displays, Micro Optics, and many other related applications.
About Alexander Forozan: Mr. Alexander Forozan has been the Vice President of Global Sales and Business Development since 2005. He is responsible for Heidelberg Instruments’ global revenue generation, as well as overseeing the day to day operations of the company’s international sales and marketing force. He joined Heidelberg Instruments in February 2001, serving as Manager of Marketing and Technical Sales in North America, and later Director of North and South American Sales. In this capacity, he grew the American market segment from a limited presence into a multi-million dollar enterprise instantly recognizable at many of the finest research institutions.
He began his career at Intel Corporation where he worked in Rio Rancho Fabrication site as a process engineer before joining the Assembly Technology Development in Chandler, Arizona, contributing to the chipset packaging for Mobil Computers. After Intel, he joined Mattel Corporation in El Segundo, California, where he was a lead Corporate Product Engineer working on interactive and high tech toy products (a joint venture between Intel and Mattel corporations). At Mattel Corp. he was active in several international projects ranging from management and coordination of United States operations with those of production in China to qualification of licensing in Latin America. Mr. Forozan holds a B.S. and M.S. in Engineering. He also holds executive business management from the University of California at Berkeley, Haas School of Business.