Ronkonkoma, NY (PRWEB) August 22, 2013
Advanced Component Testing is pleased to announce it has been audited and approved by the Defense Logistics Agency (DLA) and has earned lab suitability for QTSL testing. ACT is currently the only DLA suitable lab to perform counterfeit detection testing, including full electrical testing, as per the AS6081 standard.
ACT’s newly acquired suitability will allow the lab to test FSC 5961 and 5962 military devices for QTSL Distributors part of the DLA’s Qualified Testing Suppliers program. The program establishes a list of pre-qualified distributors who supply the government products that no longer have traceability back to the manufacturer. Allowing Advanced Component Testing to perform testing on these products ensures their conformance to the original manufacturer’s specifications, improving the quality and services provided by the DLA.
“Being named the only DLA suitable QTSL testing facility for counterfeit detection services demonstrates ACT’s commitment to counterfeit risk mitigation and dedication to providing the most advanced counterfeit detection techniques. Advanced Component Testing understands the prevalence and severity of counterfeit electronic components in the market today, especially in highly reliable applications such as those associated with the military,” stated Mike Zambito, VP of Operations at Advanced Component Testing.
About Advanced Component Testing:
ACT prides itself on serving as an ISO 17025 accredited laboratory, positioned at the forefront of technical competence in testing and component authenticity within the mil-aerospace, commercial, medical and automotive industries. ACT’s dedication to using the most current counterfeit detection technology combined with our proprietary database, experienced engineers, industry compliant testing procedures and state of the art equipment, makes us as a leader in counterfeit component detection. Our advanced counterfeit mitigation processes include: Functional Electrical Testing, Group A Electrical Testing, Solderability, Decapsultation/De-lidding, Internal Visual Die Inspection, Material Analysis/Device Composition, Component Surface Inspection, X-ray Die Bond and Frame Inspection, Physical Dimension Inspection, Marking Permanency, XRF Spectrum Analysis, Proprietary OCM Die database, Bake/Dry Pack, Tape/Reeling, and Device Programming, Engineering review, and Comprehensive report.