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ADLINK Extreme Performance ATCA Blades Launch with Refreshed Dual Intel® Xeon® Processors E5-2658 v2 and E5-2648L v2
  • USA - English


News provided by

ADLINK Technology, Inc.

Sep 11, 2013, 13:30 ET

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ADLINK's Dual Intel® Xeon® Processor E5-2648L v2 10 GbE ATCA Processor Blade
ADLINK's Dual Intel® Xeon® Processor E5-2648L v2 10 GbE ATCA Processor Blade

The continuous improvement of Intel processor performance gives OEMs a simple upgrade path to get the most out of their workloads.

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San Francisco, CA (PRWEB) September 11, 2013 -- Intel Developer Forum - ADLINK Technology, Inc., a leading provider of trusted telecom computing products, today announced availability of the enhanced aTCA-6250 and aTCA-6200A, AdvancedTCA® (ATCA) processor blades with robust computing power, high throughput connectivity, and accelerated packet processing capabilities. Featuring dual 10-core Intel® Xeon® processors E5-2658 v2 and E5-2648L v2 (2.4 GHz/1.9 GHz) paired with the Intel® C604 chipset, the aTCA-6250 and aTCA-6200A provide distinctive capabilities in support of carrier-grade applications requiring maximum computing power, reliability, and high network/storage throughput, such as media servers in IPTV, IP Multimedia Subsystem (IMS) broadband networks, network security, network monitoring/analysis, and wireless infrastructures.

“Our enhanced ATCA blades are designed for NEBS compliance and give telecom equipment manufacturers and network equipment providers a powerful, high bandwidth solution for mission critical applications and a smooth upgrade and growth path,” said Yong Luo, head of ADLINK’s Embedded Computing Product Segment. “With Intel® Hyper-Threading Technology and Intel® Turbo Boost Technology, the combination of the new generation of Intel® Xeon® processors and Intel® C604 chipsets provides increased performance from both single and multi-thread workloads while maintaining thermal and energy efficiency.”

"The new Intel® Xeon® processors E5-2600 v2 product family provides integrated memory and two Intel® QuickPath Interconnect point-to-point interfaces for high bandwidth and low latency between processors,” stated Frank Schapfel, senior product line manager, Intel Communications Infrastructure Division, Intel. "The continuous improvement of Intel processor performance gives OEMs a simple upgrade path to get the most out of their workloads. With the additional processor performance headroom, data plane workloads are easier to implement on Intel Architecture based platforms.”

The refreshed aTCA-6250 processor blade offers eight channels of DDR3-1866 memory up to 128 GB, and a 400 W power supply subsystem for maximum computing performance. It provides versatile connectivity, including dual 10GbE Fabric Interfaces, dual GbE Base Interfaces, quad front panel GbE interfaces, dual front panel USB and COM ports, and onboard SATA DOM socket. Dual 10GbE ports and dual hot-swappable SAS bays on the optional aTCA R6270 Rear Transition Module (RTM) provide additional network throughput and storage capabilities.

The aTCA-6250 supports the Intel® Data Plane Development Kit (Intel® DPDK), a lightweight run-time environment for Intel® architecture processors offering low overhead and run-to-completion mode to maximize packet processing performance. Support for Intel® QuickAssist Acceleration Technology provides additional optimization of packet and network capabilities by offloading tasks to the aTCA-6250’s optional mezzanine card, freeing up CPU resources.

The refreshed aTCA-6200A features DDR3-1866 memory up to 128GB and a PICMG® mid-size AMC bay for flexible expansion, supporting AMC.1 PCI Express and Advanced Switching, AMC.2 Gigabit Ethernet, and AMC.3 SATA/SAS storage expansion. On-card connectivity includes dual 10GBASE-KX4 Fabric Interfaces, dual GbE Base Interfaces, dual front panel GbE egress ports, onboard bootable CFast socket, onboard 2.5" SATA drive space, and modular Fabric riser card for additional PICMG Fabric Interface protocols. Dual hot-swappable SAS bays on the optional aTCA R6270 Rear Transition Module (RTM) provide additional network throughput and storage capabilities. The aTCA-6200A provides high-speed data-transfer on the PICMG 3.1. I/O features of the blade include Base Interface channels, Fabric Interface channels and front/rear egress ports. Front panel I/O includes two RJ-45 GbE ports, three USB 2.0 ports, an RJ-45 to DB-9 standard serial port and a DB-15 connector for analog graphics output.

For more information, please go to http://www.adlinktech.com/AdvancedTCA/.

About ADLINK
ADLINK Technology provides a wide range of embedded computing products and services to the test & measurement, automation & process control, gaming, communications, medical, network security, and transportation industries. ADLINK products include PCI Express®-based data acquisition and I/O; vision and motion control; and AdvancedTCA, CompactPCI, and Computer-on-Modules (COMs) for industrial computing. With the acquisition of Ampro Computers, Inc., ADLINK also provides a wide range of Extreme Rugged and Rugged Single Board Computers, Computer-on-Modules and Systems under the brand name Ampro by ADLINK. ADLINK strives to minimize the total cost of ownership (TCO) of its customers by providing customization and system integration services, maintaining low manufacturing costs, and extending the lifecycle of its products. ADLINK is a global company with headquarters and manufacturing in Taiwan; R&D and integration in Taiwan, China, and the US; and an extensive network of worldwide sales and support offices.

ADLINK is ISO-9001, ISO-14001, and TL9000 certified, is an Associate Member of the Intel® Intelligent Systems Alliance, an Executive Member of PICMG, and a Sponsor Member of the PXI Systems Alliance. ADLINK is a publicly traded company listed on the TAIEX Taiwan Stock Exchange (stock code: 6166).

# # #

Intel and Xeon are trademarks of Intel® Corporation in the United States and other countries.

Monica Lanctot, ADLINK Technology, Inc., http://www.adlinktech.com, +1 (408) 360-4337, [email protected]

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