Huntley, IL (PRWEB) September 24, 2013
TEQ is proud to announce their participation as a Silver Sponsor of the Healthcare Packaging Immersion Experience (HcPIE) at Michigan State University (MSU) this fall.
At this unique collaborative event between The Learning Center (LAC) at Michigan State and MSU’s world renowned School of Packaging, medical device packaging professionals and healthcare practitioners will be brought together to:
“As a company that prides ourselves on medical device packaging innovation, we are excited to participate as a sponsor of this one-of-a-kind event and help bridge gap between the package design, package engineering and the real world,” said Randy Loga, President of TEQ. “We are looking forward to being a key part of an industry experience designed to provide valuable insights nearly impossible to come by elsewhere,” Loga added.
HcPIE will be held on Oct. 2-3, 2013 at the James B. Henry Center for Executive Development on the MSU campus in Lansing, Michigan.
Founded nearly thirty years ago as TekPackaging, TEQ is dedicated to being the leader of quality manufacturing in the thermoforming industry. TEQ’s commitment to continuous improvement, design capability and process control gives the company the ability to serve customers better than anyone else.
From design and engineering, to state of the art technology and attentive and informed customer service, TEQ ensures that every aspect of every project is completed with the kind of precision that has made us the preferred choice of many clients.