CPI presents ultra-flexible OTFT device array suitable for foldable AMOLED displays of the future

CPI has developed a novel backplane fabrication process to allow the bending of OTFT arrays to small radii of 1mm without a significant reduction in device performance. The work undertaken demonstrates progress towards optimum Organic Semiconductor processing and performance to enable their integration into ultra-flexible AMOLED backplanes.

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Flexible OTFT
This demonstration of bend resistance in high performance OTFT devices is part of ongoing work to integrate these materials into active matrix backplanes for AMOLED.

Sedgefield, UK (PRWEB UK) 24 January 2014

The Centre for Process Innovation (CPI) has developed a novel backplane fabrication process to allow the bending of Organic Thin Film Transistors (OTFT) arrays to small radii (1 mm) without a significant reduction in device performance. The work undertaken demonstrates progress towards optimum Organic Semiconductor (OSC)/OTFT processing and performance to enable their integration into ultra-flexible active matrix organic light emitting diode AMOLED backplanes. High performance OSC materials with charge mobility suitable for OLED driving were used in the tests on 50 micron thick PEN film. A demonstration video of the bend testing of the array can be viewed here: http://tinyurl.com/qyc558j.

In order to achieve the tight bend radius, the multiple interfaces present in the device stack were optimised to allow good adhesion under the strains experienced in the bending test. Using patterned OSC layers and additional passivation layer processing, display pixel size OTFT s were fabricated and these were repeatedly bent (up to 10,000 times) to a radius of 1 mm, which equates to a strain of 2.5%. Minimal change in the turn on voltage and on current were observed for the elongated cycle test.

This demonstration of bend resistance in high performance OTFT devices is part of ongoing work to integrate these materials into active matrix backplanes for AMOLED. It is expected that within 2014 the first plastic based display demonstrators will be completed using OTFT in project ROBOLED, which has received funding through the Technology Strategy Board.

A paper describing the bend testing and device processing work was delivered at the recent International Display Workshop (IDW) in Sapporo, Japan – see paper number OLED3-2.

CPI is the UK’s National Centre for Printable Electronics and part of the High Value Manufacturing Catapult. Focused on the development, scale-up and commercialisation of printable electronics applications, CPI is equipped with an extensive range of assets specifically chosen and developed to allow clients to understand how their products and processes perform under pilot manufacturing conditions.

Notes to Editor

About CPI

The Centre for Process Innovation is a UK-based technology innovation centre and part of the High Value Manufacturing Catapult. We use applied knowledge in science and engineering combined with state of the art development facilities to enable our clients to develop, prove, prototype and scale up the next generation of products and processes.

Our open innovation model enables clients to develop products and prove processes with minimal risk. We provide assets and expertise so our customers can demonstrate the process before investing substantial amounts of money in capital equipment and training. New products and processes can be shown to be feasible; on paper, in the lab and in the plant before being manufactured at an industrial scale.

By utilising our proven assets and expertise companies can take their products and processes to market faster. There is no down time in production as all of the process development is completed offsite and our technology transfer and engineering teams can help companies to transfer the product or process into full scale production at speed.

http://www.uk-cpi.com


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