SOLiD to Exhibit at Mobile World Congress 2014

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Sunnyvale, CA (PRWEB) February 13, 2014

SOLiD, a wireless infrastructure company, is exhibiting at Mobile World Congress 2014.

Who: SOLiD

What: Mobile World Congress, Booth Number: 7D79

When: February 24-27, 2014

Where: Barcelona, Spain

Why: To showcase RF Amplifier and Optical Transport solutions that expand wireless coverage and capacity

To learn more or schedule an on-site meeting, please contact SOLiD.

About SOLiD
SOLiD (http://www.solid.com) is a publicly-traded global RF amplification and optical network transport solutions company that enables indoor and outdoor cellular, public-safety and Wi-Fi communications at some of the best-known and most challenging venues. SOLiD’s solutions can be found in leading hospitals; Olympic, professional, and college sports venues; government, university and Fortune 500 corporate buildings and campuses; international airports and metropolitan subways; and other high-profile sites. SOLiD’s distributed antenna system (DAS), small cell backhaul and passive optical LAN (POL) portfolio addresses current and future network densification requirements.

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