Ipoh, Malaysia (PRWEB) February 25, 2014
Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced that they have qualified and started Laminate Production in their Suzhou factory.
The shift of the semiconductor business into smartphones and tablets has led to aggressive advancements in Advanced Packaging and Interconnect Technologies. Carsem is aligned with the technology trend of moving beyond wireless and portable to wearable devices which require higher density I/Os, high-volume, high speed, low power consumption.
A leader in SiP manufacturing, Carsem provides solutions for a variety of wafer technologies and discrete components using flip chip, Gold or Copper wire bond and stacked die. With these capabilities Carsem has introduced Fine Pitch Ball Grid Array (FBGA) and Fine Pitch Land Grid Array to their packaging solutions.
Fine Pitch Ball Grid Array (FBGA) and Fine Pitch Land Grid Array (FLGA) are laminate substrate-based chip scale packaging with plastic overmolded encapsulation and an array of fine pitch solder ball terminals. Both options use the latest BOM and advanced assembly techniques to produce a reliable and cost effective package. Lead-free and halogen-free BOM sets are available.
For further details about these packaging options, please contact your local Carsem sales office, which can be found on the Carsem web site at http://www.carsem.com.
Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest ranges of package & test portfolios in the world. To meet the growing demands of the telecommunications and wireless markets for smaller, faster, thermally-efficient devices, Carsem's portfolio includes many advanced technologies, such as the Micro Leadframe Package (MLP), Flip Chip on Leadframe (FCOL™), an SiP (System-in-Package) Technology, Cavity-Package Motion and Pressure Sensor technologies as well as stacked-die capability. Carsem also offers a full range of turnkey test services for RF, mixed-signal, linear, digital and power devices. Our factories maintain world-class quality standards having achieved SAC Level 1, ISO-9001, ISO-14001, QS-9000, TS16949, ANSI-ESD S20.20 certifications, and are supported with a global network of sales and engineering support offices. Carsem is a member of the Hong Leong Group with factories located in Ipoh, Malaysia, Suzhou, China and sales offices across the USA, the UK, China, Malaysia and Taiwan. Carsem, Inc. sales headquarters is located at 269 Mt. Hermon Road, Suite 104, Scotts Valley, CA 95066, phone (831) 438-6861, fax (831) 438-6863, web site: http://www.carsem.com.