Wellesley, MA (PRWEB) March 11, 2014
According to a new technical market research report System-in-Package (SiP) Die Technologies and Global Markets, from BCC Research (http://www.bccresearch.com), the global market for SiP chipsets was valued at nearly $15 billion in 2012 and was estimated at nearly $16.3 billion for 2013. BCC Research expects the market to grow to $22.5 billion by 2018, and register a five-year compound annual growth rate of 6.7% from 2013 to 2018.
System-in-package (SiP) is a combination of integrated circuits (ICs) enclosed in a single package or module. Additionally, passive components are mounted on the same substrate. SiP is not just an IC package with multiple dies; it comprises fully functional systems or subsystems in an IC package format.
SiP, while being a packaging technique, differs substantially from other packaging technologies. The latter largely involve minimal complex design considerations, whereas for SiP, an effective subsystem or system, the interconnection and integration are substantially more complex. SiP brings tangible gains in space reduction. While system-on-chip (SoC) achieves the same objective more effectively, SoC design is more complex and time consuming than SiP. SiP’s simplicity has opened a wide array of uses for it in less than a decade since its inception.
However, SiP also faces significant challenges in being able to assure form yield maximization. Each end-use application has its own dynamics, benefits, and challenges with respect to levels of adoption of SiP-enabled chipsets. On a larger note, each end-use application has its own market momentum dictated by the health of the regional and country markets.
Technological advances, industry demand, space reduction, and simplicity of design will drive steady growth in this market for the foreseeable future.
This technical market research report from BCC Research provides an overview of the global market for system-in-package (SiP) chipsets, including analyses of global market trends, with data from 2012, estimates for 2013, and projections of compound annual growth rates (CAGRs) through 2018. It also includes a breakdown of the market along two major criteria: die technologies and end-use applications. In addition, it presents a look at many market verticals including telecommunications; medicine; computing and entertainment; consumer electronics, instrumentation, and scientific research; energy, defense, and surveillance; and industrial and automotive. Comprehensive company profiles of leading companies in the industry are also included.
This report is intended for semiconductor-packaging-service providers, to analyze the relative potency of end-application sectors further broken down by die compositions, geographical regions and key country markets; semiconductor foundries, to formulate frameworks and standards based on demand for specific end application and die compositions; semiconductor-device makers, to analyze the relative potency of end-application sectors further broken down by die compositions, geographical regions, and key country markets; SiP material and packaging-equipment suppliers, to identify the potential of their output across leading SiP end applications; and original equipment manufacturers, to analyze the benefits and prospects of SiP-enabled chipsets used in their devices, equipment, and products.