AIM Solder Brings Two Newly Developed Solder Pastes to NEPCON China 2014

AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, will highlight their new NC520 and NC273LT solder pastes in booth A2-1E57 at NEPCON China 2014, scheduled on the 23rd - 25th of April, 2014 at the Shanghai World EXPO Exhibition & Convention Center.

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Cranston, Rhode Island (PRWEB) April 14, 2014

AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, will highlight their new NC520 and NC273LT solder pastes in booth A2-1E57 at NEPCON China 2014, scheduled on the 23rd - 25th of April, 2014 at the Shanghai World EXPO Exhibition & Convention Center.

The newly developed NC520 is a no clean, halogen-free solder paste designed for the most demanding high density electronic assemblies. NC520 offers excellent wetting, improved printing and reduces voiding. The superior wetting ability of NC520 results in bright, smooth and shiny solder joints. Consistent transfer efficiencies reduce head-in-pillow defects even when component/substrate co-planarity is not optimal.

AIM's new NC273LT solder paste for bismuth containing alloys is designed for low temperature applications. This new solder paste contains a revolutionary activator system which improves the wetting performance of bismuth alloys to RoHS compliant plating and surface finishes. NC273LT offers excellent transfer efficiencies, long stencil life and minimizes solder balling, a defect common to high bismuth materials. NC273LT solder paste for bismuth bearing alloys is an excellent RoHS compliant replacement that provides assemblers with an innovative solution when temperature sensitivity is paramount.

AIM offers locally made solder paste, bar solder, wire solder, and liquid flux throughout Asia with manufacturing and stocking locations in China, Hong Kong, India, Singapore, and the Philippines.

In addition to their two new solder paste products, AIM will highlight its complete line of solder paste, liquid fluxes, tin/lead and lead-free alloys, including SN100C. To discover all of AIM’s products, visit the company in booth A2-1E57 at NEPCON China or visit http://www.aimsolder.com.

About AIM
Headquartered in Montreal, Canada, AIM Solder is a leading global manufacturer of assembly materials for the electronics industry with manufacturing, distribution and support facilities located throughout the world. AIM produces advanced solder products such as solder paste, liquid flux, cored wire, bar solder, epoxies, lead-free and halogen-free solder products, preforms, and specialty alloys such as indium and gold for a broad range of industries. A recipient of many prestigious SMT industry awards, AIM is strongly committed to innovative research and development of product and process improvement as well as providing customers with superior technical support, service and training.

Upcoming Events:
April 23-25, 2014 – NEPCON China 2014 Booth #A2-1E57 – Shanghai China
May 6-8, 2014 - SMT Hybrid Packaging 2014 Stand #9-232 – Nuremburg, Germany

For more information about AIM, visit http://www.aimsolder.com.


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