Dallas, TX (PRWEB) May 06, 2014
In the wake of the declaration made by China's government to make efforts to build an indigenous semiconductor industry in February 2014, SMIC (Semiconductor Manufacturing International Corporation) - China's leading wafer foundry - and JCET (Jiangsu Changjiang Electronics Technology Co.) - the leading packaging service provider in China - announced that they will jointly build an 12" bumping and testing facility, in which SMIC and JCET holds 51% and 49% stake, respectively. This report points out the reasons behind the SMIC-JCET cooperation and provides in-depth analysis of China's rise and the consequences thereof for the global semiconductor industry.
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List of Topics
2. Bumping a Key for Improved Wafer Yields of Advanced IC Manufacturing Technologies
2.1 SMIC Still Centers on 0.15/0.18nm and Its Advanced Manufacturing Process Share Remains Slim
2.2 TSMC's 40/45nm Wafer Share Topped Over 50%
2.3 Wafer Bumping Technology as an Indicator to Prove Advanced Packaging Capabilities
2.4 IC Manufacturers and Packaging Service Providers to Ramp Up Bumping Capacity
3. Reasons and Factors behind the Cooperation
3.1 Wafer-bumping to Help SMIC Increase Mass Production Speed
3.2 Cooperation to Reduce Risks Associated with Wafer Bumping
4.1 SMIC-JCET Cooperation Take Aims at Chinese Government Funding
4.2 The Cooperation Might Make a Stir on Market Landscape of High-end IC Manufacturings
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List of Tables
Table 1 Chinese Indigenous IC Foundries and News
Table 2 Chinese Wafer Bumping Patent Applicants and Holders
List of Figures
Figure 1 SMIC Revenue Share by Process Technology, 1Q 2011 - 4Q 2013
Figure 2 TSMC Revenue Share by Process Technology, 1Q 2011 - 4Q 2013
Related Reports on Semiconductor and Electronics Market:
Taiwanese Semiconductor Manufacturing Industry, 1Q 2014: This research report presents shipment value forecast and recent quarter review of the Taiwanese semiconductor manufacturing industry. Companies surveyed in this research are those owning facilities to make MOS (Metal Oxide Semiconductor) wafers in Taiwan, including IC foundries, DRAM (Dynamic Random Access Memory) vendors, and IDM (Integrated Device Manufacture) companies.
Taiwanese IC Packaging & Testing Industry, 1Q 2014: This research report presents shipment value forecast and recent quarter review of the Taiwanese IC packaging and testing industry. Companies surveyed in this research are contract manufacturers focusing on IC packaging and testing for IC suppliers around the world. The content of this report is based on primary data obtained through interviews, and publicly available information such as corporate financial statements.
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