The DCS 150 is the perfect sawing tool for stones in the 2 grains to 3 carats range.
Fremont, CA (PRWEB) May 08, 2014
SYNOVA S.A., a leading manufacturer of diamond sawing systems, is now selling its new DCS 150, a smaller machine that complements well the highly popular DCS 300 series. “Equipped with a 40 micron nozzle, the DCS 150 is the perfect sawing tool for goods in the 2 grains to 3 carats range,” states Joerg Pausch, Synova’s Diamond Business Director. “All the DCS machines, incorporate Synova’s novel Laser MicroJet technology that generates a parallel laser beam within a microjet of water; resulting in straight walls, tight kerf widths, smooth sawing surfaces, higher yields and a significant reduction in weight loss,” adds Pausch.
Manufacturers are benefiting from Synova’s unique expertise as an industrial micro-machining solutions provider; leveraging a knowledge base across multiple industries that have a common need for high precision and expanded hardware/software capabilities. For example, both the DCS 300 and DCS 150 integrate “Pie Sawing” capabilities, enabling the user to perform a partial pie cut in one setup, thereby eliminating the usual resetting of the stone.
“After much success in India and Belgium, Synova is now entering the Russian market, with a first machine already installed and a second machine scheduled to be delivered in June,” commented Dr Bernold Richerzhagen, CEO and President of Synova SA. “We are also excited to see a very strong response to our recent DCS launch in southern African countries of Botswana, South Africa and Namibia, with one system already sold to a South African manufacturer,” added Richerzhagen.