Global Thermoformed Product Market to Reach 9.4 Billion Lbs in 2019; Electronic Packaging Segment Moving At 4.9% CAGR

According to a new report from BCC Research, the global plastic thermoformed product market is expected to grow to 9.4 billion lbs by 2019, with a five-year compound annual growth rate (CAGR) of 4.3%. The electronic packaging category is the fastest moving subsegment in this market, growing at a CAGR of 4.9%.

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SAMPLE FIGURE GLOBAL THERMOFORMED PLASTIC MARKET BY APPLICATION, THROUGH 2019 (MILLION POUNDS)

SAMPLE FIGURE GLOBAL THERMOFORMED PLASTIC MARKET BY APPLICATION, THROUGH 2019 (MILLION POUNDS)

Global Thermoformed Product Market to Reach 9.4 Billion Lbs in 2019

Wellesley, Mass. (PRWEB) May 16, 2014

BCC Research (http://www.bccresearch.com) reveals in its new report, THERMOFORMED PLASTICS: GLOBAL MARKETS, the global plastic thermoformed product market is expected to grow to 9.4 billion lbs by 2019, with a five-year compound annual growth rate (CAGR) of 4.3%. The electronic packaging category is the fastest moving subsegment in this market, growing at a CAGR of 4.9%.

The last decade has witnessed an increase in the use of thermoformed plastic products as the result of improved technologies and cost reductions. Consequently, consumption in the food packaging category, the dominant category in the overall market, was estimated to reach 6 billion lbs by 2019, registering a 4.1% CAGR.

However, the electronics segment, which is estimated at just 388 million lbs for 2014, is projected to jump to 494 million lbs by 2019.

“Thermoformed plastics are competing more favorably with injection molding and other plastic processes in several key applications,” says BCC Research plastics analyst Melvin Schlechter. “These include rigid food and healthcare packaging, automotive, building products, appliances, and a wide array of consumer and industrial/commercial products.”

THERMOFORMED PLASTICS: GLOBAL MARKETS provides an overview of the global market for thermoformed plastics, including analyses of global market trends with data from 2013, estimates for 2014, and projections of CAGRs through 2019. It also presents information on several important thermoformed plastics applications, such as rigid food and healthcare packaging, automobiles, building products, appliances, and an array of consumer and industrial/commercial products. In addition, this study includes profiles of top companies that produce the key plastic materials that are converted into thermoformed products.

This report is intended for anyone interested in the thermoplastics market, including manufacturers, resin producers, marketers, and end users, especially those in the packaged foods market.

Editors and reporters who wish to speak with the analyst, should contact Steven Cumming at steven.cumming(at)bccresearch(dot)com.

About BCC Research
BCC Research publishes market research reports that make organizations worldwide more profitable with intelligence that drives smart business decisions. These reports cover today's major industrial and technology sectors, including emerging markets. For more than 40 years we've helped customers identify new market opportunities with accurate and reliable data and insight, including market sizing, forecasting, industry overviews, and identification of significant trends and key competitors. We partner with analysts who are experts in specific areas of industry and technology, providing unbiased measurements and assessments of global markets. Our clients include the top companies in industries around the world as well as universities, business schools, start-ups, consulting firms and investment companies. BCC Research is a unit of Eli Research LLC. Visit our website at http://www.bccresearch.com. Contact us: (+1) 781-489-7301 (U.S. Eastern time), or email information(at)bccresearch(dot)com.

Data and analysis extracted from this press release must be accompanied by a statement identifying BCC Research LLC, 49-2 Walnut Park, Wellesley, MA 02481, Telephone: (+1) 781-489-7301; Email: editor(at)bccresearch(dot)com as the source and publisher. Thank you.


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