SAE International is recruiting the top technical papers in the industry by leading experts to make this year a valuable experience for attendees.
Detroit (PRWEB) August 05, 2014
The call for technical papers is under way for the SAE 2015 World Congress. Abstract deadline is Sept. 1.
With a theme of “Leading Mobility Innovation” for the 2015 World Congress, SAE International is recruiting the top technical papers in the industry by leading experts to make this year a valuable experience for attendees.
Contributing to the SAE World Congress is an opportunity for members of the mobility industry to share their expertise to help in the advancement of engineering within the automotive spectrum. With a continued focus on quality, abstracts and papers will be examined thoroughly by volunteer experts prior to acceptance to a World Congress technical session and then again by the SAE Journal's Editorial Board for the chance of being selected to one of the SAE Journals.
The following information will be required during the online abstract submission process:
1. Tentative title
2. A summary stating the objective of the paper/presentation
3. Name of the author and co-authors and all contact information
4. Selection of the most appropriate technical session.
The SAE World Congress will be held in Detroit, Michigan on April 21-23, 2015, at Cobo Center. Honda is serving as this year’s Executive Leadership and will be joined by Continental as the Tier One strategic partner.
SAE International is a global association committed to being the ultimate knowledge source for the engineering profession. By uniting more than 145,000 engineers and technical experts, we drive knowledge and expertise across a broad spectrum of industries. We act on two priorities: encouraging a lifetime of learning for mobility engineering professionals and setting the standards for industry engineering. We strive for a better world through the work of our philanthropic SAE Foundation, including programs like A World in Motion® and the Collegiate Design Series™.