Marktech Introduces its New Line of Deep UV Emitters

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Marktech Optoelectronics has introduced the MTE280xxx series, its new line of deep ultra violet emitters in the 280 nm wavelength range

Picture of Deep ultra violet emitter in the 280 nm wavelength range

Deep ultra violet (UV) emitter in the 280 nm wavelength range

Mark Campito, Marktech’s CEO states that “what makes this new product line of special interest to manufacturers is that we offer it in one of the largest selection of packages commercially available.”

Marktech Optoelectronics has introduced the MTE280xxx series, its new line of deep ultra violet emitters in the 280 nm wavelength range. This series joins Marktech’s current line of standard UV emitters which range from 280nm to 405nm. These new devices are suitable for applications in air and water sanitation as well as curing. Mark Campito, Marktech’s CEO states that “what makes this new product line of special interest to manufacturers is that we offer it in one of the largest selection of packages commercially available.” In addition, Marktech offers this in bare die which can be placed in custom packages and assemblies of your choice. This product series is available through Digi-key.

ABOUT MARKTECH
Now celebrating its 30th year Marktech Optoelectronics is a manufacturer of sensors and InP epiwafers. Marktech maintains an onsite engineering and design team with years of experience in applications and product design. Marktech's only business is optoelectronics and we take pride in our support capabilities which features a lab containing state of the art test equipment allowing us to test and validate for all optical and electrical parameters. In addition to our sensor line Marktech is a Cree Solutions Provider for their line of High Brightness LEDs and materials.

Marktech designs and manufactures LED Chip-on-Board assemblies and multichip LEDs which incorporate multiple die configurations or wavelengths ranging from Ultraviolet to SWIR. Our technical and production engineers manage a vertically integrated manufacturing process of circuit layout, die wafer and chip processing, die attachment and finished product assembly. Throughout all of our processes, the highest levels of quality assurance are in place making sure that the initial design is carried through the entire process.

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Patti Wrobel
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