Marktech Optoelectronics Announces Optoelectronic Chips and Materials for Emission and Detection Applications

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Chips range from deep ultraviolet to short wave infrared with numerous materials offered in between these ranges

Color Picture of Emitter Die

Emitter Die

'Cree’s extensive line-up of LED chips truly helps Marktech address many types of custom component and assembly applications,' says Steve Hubert, Product Manager for Cree products at Marktech.

Marktech Optoelectronics has made available its wide array of emitter die ranging from deep ultraviolet 280nm to 1720nm short wave infrared and numerous materials in between these ranges, including Cree green and blue die. Marktech also features detector die from 150nm to 2600nm, InGaAs/InP epitaxial wafers from 1.0um to 2.6um and custom wavelengths up to 4000nm for emitters.

In the blue and green ranges, Marktech features Cree LED die. Cree combines highly efficient InGaN materials with proprietary G•SIC® substrates to deliver superior price/performance for high-intensity LEDs used in low and high power LED applications. Marktech, as a value added partner for Cree, offers customized packaging options for Cree products including TO-Metal Can packaging with customized optics as well as chip on board arrays. “Cree’s extensive line-up of LED chips truly helps Marktech address many types of custom component and assembly applications,” says Steve Hubert, Product Manager for Cree products at Marktech.

The specific wavelengths that we offer for die and materials can be found on Marktech’s easy to navigate Product Selector Guide.

Marktech offers in-house value added testing including narrow die sorting in some cases down to +/-1nm. Additional brightness, power output and wavelength binning services are also available. LED Die is generally shipped on blue membrane tape but waffle packing on some chips is also available.

Applications for such a wide range of chips, run the gambit from Curing, Architectural Lighting, Machine Vision, Medical Illumination, Communications, Spectroscopy and Currency Validation, to name a few.

An additional advantage for design engineers is Marktech’s ability to put selected die(s) in a variety of packages including standard packages, custom assemblies and COB (Chip on Board). Please contact our engineering services department to discuss your design.

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Patti Wrobel
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