NXP Simplifies Point of Sale Design with Complete Reference Kits
Eindhoven, Netherlands (PRWEB) October 28, 2014 -- NXP Semiconductors N.V. (NASDAQ:NXPI) today introduced EMVCo (Europay, MasterCard and Visa) compliant hardware and software design kits for contact and contactless payment systems, significantly reducing the technological barriers-to-entry typically seen with new point of sale (POS) terminals. Each variant of the design kit (OM5597/RD2612 and OM5597/RD2663) is offered with an EMV Level 1 compliant software stack for both contact and contactless payment. The OM5597/RD2612 implements an antenna amplifier to optimize RF performance and also includes NXP’s near field communication (NFC) front-end device (PN512) to allow designers to explore the potential for NFC-based payment applications. The OM5597/RD2663 uses NXP’s CLRC663 high performance NFC reader solution and achieves EMV Level 1 RF compliance without needing an additional booster.
According to ABI Research, POS terminal shipments reached 13.8 million units in 2013 and are expected to increase to 15.6 million units in 2016. Despite heavy adoption in many countries there are still some very large and mature payment markets that have not yet fully migrated to EMV or contactless technology, such as the USA and China. Being able to support a faster design cycle for POS terminal designers increases competiveness in these developing markets and ultimately reduces the time it takes to replace legacy payment terminals. Shipments of mobile point of sale (mPOS) terminals are expected to increase substantially in the coming years, reaching 51 million terminals by 2019*. With embedded NFC functionality the OM5597 designs kits can also be used as a tutorial for designers looking to enter the mPOS market.
“The key to a successful roll-out of secure contactless payments in the remaining markets depends on the speed at which businesses, large or small, can access the latest technology. Our new OM5597 design kits with EMV Level 1 certified software components will help designers that are not so familiar with payment technologies get a head start in their development cycle,” said Rutger Vrijen, vice president and head of strategy, business unit identification, NXP Semiconductors. “The inclusion of NFC in the design kits will bring greater flexibility to terminals by offering, for example, peer-to-peer data exchange, loyalty tracking or targeted marketing. It also opens opportunities in new markets or application areas such as consumer electronics, home appliances, automotive and computing.”
Features of the OM5597 design kits:
• EMVCo compliant contactless smart card reader PN512 or CLRC663
• EMVCo compliant contact smart reader based on TDA8026
• EMV Level 1 compliant contact and contactless software stack
• Variety of showcases to highlight use cases:
-- MInitial steps of contact and contactless EMV payment
-- Initial steps of payment with a mobile phone including peer-to-peer data exchange
-- Closed loop payment based on MIFARE DESFire EV1 together with MIFARE SAM AV2
Availability and pricing:
For further information on the kit and to download documentation and software please visit http://www.nxp.com/demoboard/OM5597.html
*According to ABI Research
About NXP Semiconductors
NXP Semiconductors N.V. (NASDAQ: NXPI) creates solutions that enable secure connections for a smarter world. Building on its expertise in High Performance Mixed Signal electronics, NXP is driving innovation in the automotive, identification and mobile industries, and in application areas including wireless infrastructure, lighting, healthcare, industrial, consumer tech and computing. NXP has operations in more than 25 countries, and posted revenue of $4.82 billion in 2013. Find out more at http://www.nxp.com.
ENDS
Forward-looking Statements
This document includes forward-looking statements which include statements regarding NXP’s business strategy, financial condition, results of operations and market data, as well as other statements that are not historical facts. By their nature, forward-looking statements are subject to numerous factors, risks and uncertainties that could cause actual outcomes and results to be materially different from those projected. Readers are cautioned not to place undue reliance on these forward-looking statements. Except for any ongoing obligation to disclose material information as required by the United States federal securities laws, NXP does not have any intention or obligation to publicly update or revise any forward-looking statements after NXP distributes this document, whether to reflect any future events or circumstances or otherwise. For a discussion of potential risks and uncertainties, please refer to the risk factors listed in NXP’s SEC filings. Copies of NXP’s SEC filings are available from the SEC website, http://www.sec.gov.
Martijn van der Linden, NXP Semiconductors, http://www.nxp.com, +31 610914896, [email protected]
Share this article