New Thermally Conductive, Electrically Insulative One Part Epoxy for Die Attach Applications: Master Bond Supreme 3HTND-2DA

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Master Bond Supreme 3HTND-2DA is a fast curing, one component, high performance, insulating epoxy system for die attach applications.

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Formulated for die attach applications, Master Bond Supreme 3HTND-2DA is a fast curing, high performance one component epoxy system. It cures in 5-10 minutes at 150°C and has unlimited working life at room temperature. It is available in syringes and has a shelf life of 6 months when stored at 40-50°F.

Supreme 3HTND-2DA has a die shear strength of 19-21 kg-f and performed very well in 85/85 testing. This epoxy has excellent adhesion to metals, ceramics and silicon dies. It is serviceable over the wide temperature range of -100°F to+400°F. As a toughened system, it offers the ability to withstand rigorous thermal cycling and shock.

In accordance with die attach application requirements, this product passes NASA low outgassing test specifications. Supreme 3HTND-2DA has low ionics, particularly chlorine (<15 ppm). It also features dimensional stability, superior thermal conductivity, electrical insulation properties and a glass transition temperature of 100-105°C.

Unlike many other die attach systems, Supreme 3HTND-2DA is not premixed and frozen, but it requires refrigeration for storage. This system dispenses smoothly or without any tailing. It well suited for automatic dispensing equipment. With a viscosity of over 300,000 cps (thixotropic), it can be applied to a defined area without running.

Master Bond Toughened Epoxy Compounds
Master Bond Supreme 3HTND-2DA is a NASA low outgassing system for die attach applications featuring thermal conductivity, high temperature resistance and toughness. Read more at http://www.masterbond.com/properties/flexibilized-and-toughened-adhesive-systems or contact Tech Support. Phone: +1-201-343-8983 Fax: +1-201-343-2132 Email: technical(at)masterbond(dot)com.

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Jane Trager
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