Oxford, MA (PRWEB) February 03, 2015
IPG Photonics Corporation Microsystems Group, has introduced the IX-280-ML, a dual-laser micromachining system for manufacturing, general purpose and R&D applications, including high-speed laser cutting, polishing and chamfering of sapphire. The system can be configured with two installed lasers, each with its own beam delivery system optimized for specific types of micromachining work. Combinations of fiber lasers and beam delivery systems can be optimized to address high-precision; cutting, drilling and patterning micromachining applications. It represents the optimum combination of IPG’s advanced laser and materials micro-processing workstation technologies.
IPG’s IX-280-ML is a fully enclosed and interlocked CDRH Class 1 system. It can be equipped with lasers operating at wavelengths from 1070 nm down to 193 nm and with focused beam, shaped beam, scanned beam or thermal cutting head beam delivery systems. Two different and independent laser sources are supported on a common precision mechanical platform. The system core consists of special structural design granite to minimize the effects of vibration and thermal drift on the overall accuracy of the product. The IX-280-ML features a high-resolution, high-performance microscope vision system which provides a continuous zoom range from 38X to 880X for optional sub-micron automated part alignment and inspection. System software includes macro-building tools for fast programming and generation of automated processes for complex feature machining. Additional utilities allow complex pattern input from standard CSV and DXF files.
Applications for IPG’s IX-280-ML include sapphire cutting for mobile device covers and accessories, cutting and drilling of ceramics for semiconductor and LED packaging and processing of metals, polymers and semiconductor materials, including patterning of ITO and other thin-films. By appropriate selection of laser sources, 2 micron diameter holes in polymers can be drilled on the same system that drills 30 micron holes in 380 μm alumina at a rate of over 750 holes per second. Cutting examples include sapphire at 12 mm/sec for 400 μm material to 250 mm/sec for 380 μm alumina. Incorporation of the company’s 20 W 532 nm fiber laser and galvanometer allows high-quality processing of materials such as polymers, silicones and FR-4 composites.
"The IX-280-ML brings processing capabilities traditionally requiring separate machines into a single high-precision workstation,” states Thomas Petersen, VP, Materials Processing Systems. “Utilizing common equipment modules such as granite structures, precision mechanical stages and automated vision components maximizes return on investment for our customers. The IX-280-ML, featuring high wall-plug efficiency, a compact footprint and decreased training and production costs, also boasts the lowest cost of ownership of any professional laser micromachining workstation.”
About IPG Photonics Corporation IPG Photonics Corporation is the world leader in high-power fiber lasers and amplifiers. Founded in 1990, IPG pioneered the development and commercialization of optical fiber-based lasers for use in a wide range of applications such as materials processing, advanced applications, telecommunications and medical applications. Fiber lasers have revolutionized the industry by delivering superior performance, reliability and usability at a lower total cost of ownership compared with conventional lasers, allowing end users to increase productivity and decrease operating costs. IPG has its headquarters in Oxford, Massachusetts and has additional plants and offices throughout the world. For more information, please visit http://www.ipgphotonics.com.
Visit IPG Photonics and the IX-280-ML at MD&M West 2015, Booth #3071, February 10-12, Anaheim, CA.
CONTACT: John Bickley
Director of Sales & Marketing
IPG Photonics Microsystems Division