AIM Solder to Introduce Newly Developed M8 No Clean Solder Paste at IPC APEX Expo 2015

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AIM Solder announces the release of the newly developed M8 Solder Paste at the IPC APEX Expo 2015 held February 24-26th at the San Diego Convention Center in San Diego, California. An evolution of the highly successful NC258 platform, M8 is designed for the most demanding high-density electronic assemblies and brings no clean solder paste to the next level.

AIM Solder announces the release of the newly developed M8 Solder Paste at the IPC APEX Expo 2015 held February 24-26th at the San Diego Convention Center in San Diego, California. An evolution of the highly successful NC258 platform, M8 is designed for the most demanding high-density electronic assemblies and brings no clean solder paste to the next level.

Developed in combination with T4 and finer lead-free alloy powders, M8 provides stable transfer efficiencies required for today’s challenging applications. A novel activator system provides powerful, durable wetting action accommodating a wide range of profiling processes and techniques. M8 eliminates HiP defects on BGAs and reduces voiding on QFN/BTC components while producing bright shiny solder joints, leaving minimal, high purity residue engineered to be safely left in place.

Along with introducing M8 Solder Paste and exhibiting their full line of solder assembly materials in booth #519, AIM’s Vice President of Technology, Karl Seelig, will present the white paper titled “Sample Preparation for Mitigating Tin Whiskers in Alternative Lead-Free Alloys” during the Technical Conference. AIM is collaborating with universities in to develop methods of growing tin whiskers to gain understanding of their growth mechanism and what other mitigation strategies can be employed to reduce their propagation. In this presentation, Seelig shares these findings as well as discusses how AIM has continued alloy development and has finalized several alloys that have demonstrated minimizing whisker formation when compared to widely used tin-silver-copper and tin-copper alloys. Seelig’s presentation is scheduled on Tuesday, February 24th at 3:30 pm in Room 3.

For more information about the revolutionary new M8 Solder paste and AIM’s complete line of solder products and services, including lead-free and halogen-free products and SN100C, visit the company at booth #519 at IPC APEX 2015 or visit http://www.aimsolder.com.

About AIM
Headquartered in Montreal, Canada, AIM Solder is a leading global manufacturer of assembly materials for the electronics industry with manufacturing, distribution and support facilities located throughout the world. AIM produces advanced solder products such as solder paste, liquid flux, cored wire, bar solder, epoxies, lead-free and halogen-free solder products, preforms, and specialty alloys such as indium and gold for a broad range of industries. A recipient of many prestigious SMT industry awards, AIM is strongly committed to innovative research and development of product and process improvement as well as providing customers with superior technical support, service and training. For more information about AIM, visit http://www.aimsolder.com.

Upcoming Events:
February 24-26, 2015 – IPC APEX Booth #519 – San Diego, California USA
March 24, 2015 – SMTA Dallas – Plano, Texas USA
March 26, 2015 – SMTA Houston – Stafford, Texas USA
April 21-23, 2015 – Nepcon China Shanghai 2015 – Shanghai China

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Alana Grear
AIM Solder
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