OnChip Introduces New Series of Space Saving Bare-die Zener Diodes for Transient Voltage Suppression

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Silicon ESD Zener Diodes as small as 8x8 mils sq and 4 mils thick offer protection for High-Brightness LED and Multi-chip Module applications.

These ESD88 diodes are offered in a variety of different formats including GelPaks (shown above).

OnChip Devices, a world leader in Integrated Passive Devices (IPD), has introduced miniature, wire bondable, silicon ESD (Electrostatic Discharge) protection diodes targeted for High Brightness and Power LED markets. The ESD88NP and ESD88PN are designed to redirect high transient currents away from sensitive LED and IC products. These Zeners exhibit no device degradation when compared to Multilayer Varistors (MLV). All devices meet the requirements of IEC61000 and safely dissipate ESD strikes of over 8kV when tested to the stringent MIL-STD-883 conditions. These products are Pb-free and conform to all RoHS requirements.

OnChip’s ESD88 diodes are ideal for computers, TVs, LEDs, medical instruments, and portable electronics. They work to protect over-voltage on I/O and power lines, protecting any downstream components. High Brightness LEDs (HB LED) and High Power White LEDs using InGaN technology are manufactured to enable a market transition to energy efficient Solid-State Lighting (SSL). These LEDs continue to make major inroads into lighting applications that were conventionally dominated by incandescent light and other light sources. LEDs can be found in a wide array of applications ranging from traffic signals and automotive brake lights to full-color displays and LCD backlights. However, one of the main drawbacks of HB LED products is the fact that they are extremely sensitive to ESD. OnChip’s ESD88 diodes help to eliminate this weakness.

The ESD88 series features an 8 x 8 mils sq chip size with an option for either 4 or 6 mil thickness. They are available with a variety of breakdown voltages such as 5, 7, 10, and 13V.The ESD88NP has a wire bondable cathode top pad and anode bottom, while the ESD88PN features a wire bondable anode and cathode bottom. The small chip size is ideal for protecting sophisticated Multi-chip Modules (MCM) and System-on-a-chip (SoC) applications. Protection from positive and negative voltage surges (AC signals) can be made possible by connecting two diodes back to back.

Availability and Pricing
OnChip’s ESD88NP and ESD88PN diodes are available immediately worldwide. They can be shipped as undiced 5” wafers, diced on Mylar tape as well as in GelPaks/Waffle Packs. These devices sell in the price range of $0.06 to $0.09 in production volumes and when shipped on tape. These components are designed and developed at OnChip Devices' Santa Clara facility and are produced to the highest quality standards.

About OnChip Devices
OnChip Devices is headquartered in Santa Clara, CA and is a global leader in Integrated Passive Devices. With its own silicon fabrication facility and strong partnerships with full turnkey assembly and test houses in Asia, OnChip is offering state-of-the-art silicon and ceramic solutions for High Brightness LED, Computing, and Consumer Electronics.

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Ashok Chalaka
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