London, UK (PRWEB) March 23, 2015
The integrated circuit (IC) substrate industry may come up against certain difficulties throughout 2015 on the back of such factors as the growing maturity of FOWLP, as well as a decline in tablet sales decline and sluggish growth of the smartphone sector. Additionally, the boom of the IC substrate industry in 2013 contributed to a vast expansion of enterprises in 2014, thus resulting in insufficient capacity utilisation rates.
FOWLP has been an irresistible trend despite it being at its infant stage and having no apparent economic benefits, and the traditional FC-CSP (flip-chip chip-scale package) substrate will have to bring down the price to join the competition, with the demand for the latter expected to be sharply decreased by over 60% as soon as FOWLP matures. Therefore, FC-CSP substrate vendors in 2015 have to considerably lower the price to gain market edge reasonably in advance. In 2015 the value of the IC substrate market is expected to drop to USD 7.12 billion.
In 2015, SiP (system-in-a-package) packaging substrate is set to be the highlight for the IC substrate market as core components needed to make high-end smartwatches must adopt SiP packaging technology. Both the two core processors in the Apple Watch use SiP packaging technology. The most essential SiP substrate of the Apple Watch requires complex manufacturing and is priced 4-5 times higher than FC-CSP applied to conventional ARM processor.
New cutting-edge report “Global and China IC Substrate Industry Report, 2015” created by ResearchInChina has been recently published at MarketPublishers.com.
Title: Global and China IC Substrate Industry Report, 2015
Published: March, 2015
Price: US$ 2,200.00
The study sheds light on the status quo of the semiconductor and IC packaging industry globally with a focus on China. It provides an in-depth assessment of the IC substrate industry, examining major developments and trends in the marketplace, along with reviewing the key downstream markets. It proves a deep analysis of the IC substrate market and industry, covering essential relevant information and data. The research report offers a detailed investigation of the competitive landscape and includes profiles the top 13 IC substrate vendors and the 6 leading IC substrate packaging firms.
IC substrate vendors: Unimicron, Daeduck Electronics, Ibiden, Simmtech, LG Innotek, Semco, Nan Ya PCB, Kinsus, Shinko, Kyocera SLC, Access, AT&S, and Eastern.
IC substrate packaging firms: ASE, Ajinomoto, SPIL, Mitsubishi Gas Chemical Company, STATS ChipPAC, and Amkor.
Reasons to Buy:
- Get access to accurate information on the current status of the world semiconductor and IC packaging industry.
- Gain knowledge on key downstream markets of IC substrate.
- Track the major development trends in the marketplace.
- Investigate the competitive climate and identify the dominant market players.
- Comprehensive analysis of the top IC substrate vendors and packaging companies facilitates search for prospective partners.
- Unbiased market and industry analysis helps deepen your foothold in the marketplace and increase sales activity.
- Discover fruitful investment opportunities by getting shrewd insights into the market.
More new studies by the publisher can be found at ResearchInChina page.