“Arteris FlexNoC Version 3 allows our customer’s SoC design capacity to scale in line with their SoC complexity and schedules,” said K. Charles Janac, President and CEO of Arteris.
CAMPBELL, California (PRWEB) April 08, 2015
Arteris Inc., the inventor and only supplier of silicon-proven commercial network-on-chip (NoC) interconnect IP solutions, today announced availability of FlexNoC Version 3 (v3) interconnect fabric IP designed to help chip designers create more sophisticated chips, more quickly.
Version 3 of Arteris FlexNoC enables designers to avoid the economic penalties for being late to market by addressing SoC complexity, which has exploded with the growth of mobile phone, consumer and automotive electronics.
FlexNoC Version 3 incorporates the following features to increase SoC designer productivity:
- Switch-based topology editor – It is now easier to create, characterize and modify large designs while keeping access to the entire SoC topology available within a single view.
- Topic- and activity-based user interface – Years of customer feedback and human factors research have resulted in a streamlined interface that makes it easier for SoC architects and designers to perform complex and repetitive tasks.
- NoC composition enhancements – Users can more easily break large interconnect designs into smaller modules for implementation by different sub-teams, and can quickly combine separate designs or modules into a single interconnect instance for integration.
Additionally, FlexNoC v3 provides a foundational platform for future IP technology development.
“Arteris FlexNoC Version 3 allows our customer’s SoC design capacity to scale in line with their SoC complexity and schedules,” said K. Charles Janac, President and CEO of Arteris. “This major technological advance provides not only an improved framework for SoC creation and assembly, but also a technology foundation from which revolutionary new capabilities are being built.”
Arteris FlexNoC is the industry-standard SoC interconnect fabric IP, powering the on-chip communications within the world’s most sophisticated SoCs created by Samsung, Renesas, HiSilicon, Altera, Mobileye and many others.
Arteris FlexNoC Version 3 is available today, and as an upgrade to existing versions of Arteris FlexNoC interconnect IP.
Arteris, Inc. provides Network-on-Chip interconnect IP and tools to accelerate System-on-Chip semiconductor (SoC) assembly for a wide range of applications. Rapid semiconductor designer adoption by customers such as Samsung, Altera, and Texas Instruments has resulted in Arteris being the only semiconductor IP company to be ranked in the Inc. 500 and Deloitte Technology Fast 500 lists in 2012 and 2013. Customer results obtained by using the Arteris product line include lower power, higher performance, more efficient design reuse and faster SoC development, leading to lower development and production costs. More information can be found at http://www.arteris.com.
Arteris, FlexNoC and the Arteris logo are trademarks of Arteris. All other product or service names are the property of their respective owners.