“This document has an amazing depth of information and details on the forecasted progress of the electronics manufacturing business, in all technology sectors and in all major product markets,” said Bill Bader, CEO of iNEMI.
Herndon, Virginia USA (PRWEB) April 08, 2015
The International Electronics Manufacturing Initiative (iNEMI) today announced that its 2015 Roadmap is now on sale. With more than 1900 pages and 24 chapters, this latest edition of the roadmap provides a valuable snapshot of the global electronics manufacturing supply chain in the third millennium.
“This document has an amazing depth of information and details on the forecasted progress of the electronics manufacturing business, in all technology sectors and in all major product markets,” said Bill Bader, CEO of iNEMI. “We encourage you to make the small investment to purchase this excellent learning tool for your organization’s use to help you focus on the right investments and technology gaps.”
The 2015 Roadmap covers five product sectors and 19 technology areas. (See complete list: http://www.inemi.org/news/purchase-2015-roadmap#peg) New this year is the Power Conversion Electronics chapter, which is provided by PSMA (Power Sources Manufacturing Association). In addition, the RF Components & Subsystems chapter, which has been absent for two cycles, has returned.
Development of this latest roadmap was a global collaborative effort involving many individuals who are leading experts in their respective fields and who represent many perspectives on the electronics manufacturing supply chain. Approximately 500 individuals from at least 20 countries, and representing more than 280 corporations, consortia and associations, government agencies, and universities came together to create the 2015 Roadmap.
Several key trends identified in the roadmap have significant impact on technology areas up and down the supply chain. A few of these are highlighted below.
MEMS & Sensors — Microelectromechanical systems (MEMS) are some of the most rapidly growing components of the electronics industry. MEMS devices are a key enabling technology for many of today’s high-tech products, including automotive sensors, smart phones and wearable fitness devices. They are also supporting new breakthroughs in portable medical diagnostic and treatment technologies — expected to be the next wave of medical electronics applications — and the future of IoT (Internet of Things).
Internet of Things — The explosive growth of mobile Internet applications has created massive demand for mobile data and dramatic growth in mobile video. As IP and video traffic continue to grow at a rapid pace, the telecommunications system and everything down to semiconductor chips must grow proportionally (from both a capacity and performance viewpoint) to support this traffic.
As the number of devices increases, new technologies will be required to enable these devices to connect with each other and the Internet. One possibility is to have self-organizing networks that, if implemented at the protocol level, would allow many devices out of range of an access point to connect to the Internet via other devices. From a hardware perspective, implementation of this technology could significantly reduce power consumption as devices could be designed with a reduced RF range. This technology is one of the keys to enabling the growth and success of IoT.
Silicon Integration — Consumer demand for thin multifunctional products continues to grow; and cost, power, bandwidth and form factor of these devices continue to be factors driving — and accelerating — the integration of silicon and system capabilities into a single package or single die. The convergence of mobile phones with computing and entertainment devices is a key factor in the further ramp of CMOS into SoCs (systems-on-chip), both in homogeneous and heterogeneous technologies. The classical mixed technologies in 2D system-in-package (SiP) and multi-chip-package (MCP) forms are now evolving and growing to more of a 3D MCP with a new set of electrical, mechanical and thermal challenges.
Environmental — The ever-expanding portfolio of environmental regulations — emerging from regional, national and local governments — requires in-depth technical management by many sections of the electronics manufacturing supply chain. Harmonization of global requirements continues to be a major challenge, and is an issue that needs to be addressed by international standardization.
For additional information, download the 2015 Roadmap Executive Summary Highlights document (http://thor.inemi.org/webdownload/RM/2015_RM/2015RM_Exec_Sum_Highlights.pdf).
Purchase the Roadmap
The complete roadmap is available on a USB drive for $3,500 (U.S.), and individual chapters can be downloaded for $500 each. Special pricing is available for universities, government agencies, research laboratories, associations/consortia and other non-profits.
The 2015 iNEMI Roadmap can be purchased on the iNEMI website (http://www.inemi.org/news/purchase-2015-roadmap#purchase), as well as from SMTA, EIPC, Electronics.ca, TPCA and Reed Exhibitions-Shanghai Branch.
The International Electronics Manufacturing Initiative’s mission is to forecast and accelerate improvements in the electronics manufacturing industry for a sustainable future. This industry-led consortium is made up of approximately 100 manufacturers, suppliers, industry associations and consortia, government agencies and universities. iNEMI roadmaps the needs of the electronics industry, identifies gaps in the technology infrastructure, establishes implementation projects to eliminate these gaps (both business and technical), and stimulates standards activities to speed the introduction of new technologies. The consortium also works with government agencies, universities and other funding agencies to set priorities for future industry needs and R&D initiatives. iNEMI is based in Herndon, Virginia (near Washington, D.C.), with regional offices in Shanghai, China; Limerick, Ireland; and Tokyo, Japan. For additional information about iNEMI, go to http://www.inemi.org.