Obsidian Technology Introduces USB 3.1 Type-C E-Marker Device

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0.7mm2 E-Marker Chip from Obsidian Technology is the lowest cost Type-C cable E-Marker

Die Photo of Obsidian's E-Marker Chip

Obsidian's E-Marker Die

With a die area of just 0.7mm2, the device offers the smallest possible E-Marker solution that will fit a WLCSP package.

Obsidian Technology, a first mover in USB Power Delivery Technology, introduces an innovative Type-C cable E-Marker chip, based on it's silicon proven Power Delivery port chip IP.

The USB Type-C cable standard is quickly gaining acceptance among phone, tablet, and PC OEMs and ODMs, because of it's small size, user-friendliness, high speed, and backwards compatibility features. Support for USB Power Delivery, will also eliminate mains power bricks for many applications.

Since the USB 3.1 cable is largely a replacement for current USB cable production, the volume of E-Marked USB cable is likely to exceed 1 Billion units per year world wide.

To facilitate low cost production, Obsidian Technology is introducing the ultimate in low cost cable E-Marker devices designated the OTC9115. With a die area of just 0.7mm2, the device offers the smallest possible solution that will fit a WLCSP package. This, in combination with Obsidian's low cost structure, will enable volume pricing to be sub-8c for 2016 production. Additionally, only two external capacitors are required for a complete solution, further lowering overall system cost.

The OTC9115 device includes a number of advanced features: An innovative receiver design, which significantly exceeds the stringent noise requirements of the specification. An active Ra pull down circuit lowers the power dissipation to below 1mW. Due to the integration of power diodes, no external active devices are required. Programming of the device is achieved through the Power Delivery protocol - allowing programming at final cable test, and reducing pin count.

Sample OTC9115 devices are now available.

About Obsidian Technology:

Obsidian Technology has been a member of the USB Power Delivery Working Group since its inception, and an active participant in all the working groups interoperability meetings (IOPs). First Power Delivery silicon was demonstrated by Obsidian in November of 2011. Obsidian is also a supplier of Power Delivery IP, that has resulted in 5 PD port silicon implementations by major OEM's.

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Robert Heaton
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