New Applications and Products Leading WLP to Mainstream Market with Big CAGR, Says BCC Research

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According to the new report from BCC Research, the global wafer-level packaging (WLP) market was valued at $1.3 billion in 2013. This market is expected to grow from $1.6 billion in 2014 to $4.9 billion by 2019, with a compound annual growth rate (CAGR) of 24.5% from 2014 to 2019.

The global wafer-level packaging (WLP) market is expected to reach $4.9 billion by 2019

Growing global demand for smartphones and tablets, particularly in emerging markets like Asia-Pacific, is driving major market growth. BCC Research reveals that this demand, in turn, is increasing consumption of semiconductor wafers and ICs, further driving growth in the global WLP market.

WLP is an IC package completely fabricated at the wafer level and assembled with standard surface mount technology. Basically a chip-scale package (CSP) innovation, WLP permits integration of wafer fab, packaging, test and smolder in at wafer level to streamline the methodology for assembling an electronic device or gadget. By technology, the global wafer-level packaging market comprises seven technologies: Flip chip, 3D WLP, Conventional CSP, Wafer-level CSP, Compliant WLP, Nano-WLP, and Others.

The global wafer-level packaging (WLP) market is anticipated to reach $1.6 billion and $4.9 billion in 2014 and 2019, respectively, growing at a five-year (2014-2019) compound annual growth rate (CAGR) of 24.5%. Flip chip, the largest segment, should easily double its value with a CAGR of 22.7% during the forecast period. The Nano-WLP segment is expected to grow the fastest with a CAGR of 40%. The second-fastest growing segment, 3D WLP, will achieve a CAGR of 28%.

As new technologies emerge and pressure to launch new products increases, flip chip firms are prone toward changes in their manufacturing processes due to different bumping methodologies as well as changes in the raw materials themselves. Market growth of the technology stems from its many advantages over other packaging methods, such as reliability, size, flexibility, performance and cost. The wide availability of flip chip raw materials, equipment and services will continue to drive healthy growth.

“The major factor behind the growth of this segment is consumers’ increased expectations for new products. Increasing demand for new designs of smartphones, tablets, computing devices, smart home components, etc., require chips that can handle a great number of functions without disruptions,” says BCC Research analyst Sinha G. Gaurav. “WLP promises to be a key technology of the future, especially in the semiconductor industry. Increasing global demand for smartphones and tablets, particularly in the emerging markets such as Asia-Pacific and Rest Of World is one of the major drivers in the market.”

Wafer-Level Packaging: Technologies and Global Markets (SMC100A) examines the various applications of the WLP market and market dynamics of each application. The report identifies key trends related to the technologies, applications, integration, and regions (including analysis by country). Data from 2013, 2014, and projections of CAGRs through 2019 are provided.

Editors and reporters who wish to speak with the analyst should contact Steven Cumming at steven.cumming(at)

About BCC Research
BCC Research publishes market research reports that make organizations worldwide more profitable with intelligence that drives smart business decisions. These reports cover today's major industrial and technology sectors, including emerging markets. For more than 40 years we've helped customers identify new market opportunities with accurate and reliable data and insight, including market sizing, forecasting, industry overviews, and identification of significant trends and key market participants. We partner with analysts who are experts in specific areas of industry and technology, providing unbiased measurements and assessments of global markets. Recently selected as the world’s greatest market research company, BCC Research is a unit of Eli Global, LLC. Visit our website at Contact us: (+1) 781-489-7301 (U.S. Eastern Time), or email information(at)

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Steven Cumming
BCC Research
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