Tempo Semiconductor Introduces New Energy Efficient Audio Codec for Portable Audio Subsystem Including Tablet Computing, Gaming and Other Consumer and Industrial Applicat

Share Article

TSI’s New Audio Hub, is a Fully Integrated Audio Codec to Save Valuable Board Space, Cost, and Improve Time-to-Market in Portable Applications

Tempo Semiconductor Inc., (TSI), delivering essential energy efficient, high fidelity audio mixed-signal semiconductor solutions to the consumer, industrial and PC markets, today announced the TSCS454XX audio CODEC, a new energy efficient audio subsystem for portable applications. This new device minimizes board space and reduces system cost through integration.

Sam Kasgorgis, Vice President worldwide sales, commented: “TSI's new TSCS454xx with an integrated multiband compressor MBC and other DSP enhanced processing delivers natural audio experience to headphones, headsets and small form factor speakers as demanded by consumer applications with built-in flexibility, programmability and multiple ways to connect audio sources. This device has already resulted in a design win that will be coming to market in 2016."

TSI’s new TSCS454XX audio CODEC features a programmable Digital Signal Processor (DSP) that eliminates the need for higher bandwidth host processor and additional software development. This multi-channel device family supports up to three I2S/PCM interfaces that can route multiple audio streams, combined with a multiband compressor (MBC). This enables significantly louder and clearer sound from small form factor speakers, without causing overload or damage.

Used in conjunction with an on-board 12 band parametric equalizer (EQ) and dynamic range controller (DRC), the MBC provides the ability to boost and optimize headphone, headset and speaker outputs to deliver superior audio playback for multimedia applications and ringtones. Psychoacoustic Bass Boost (PBB) can be enabled for improved perceived low frequency response for playback on energy efficient small factor speakers. Additionally, the TSCS454xx incorporates immersive 3D surround and Treble Enhancements, with integrated All-Digital High Efficiency Filter-less (DDX™) stereo speaker amplifier that can drive up to 3 Watts/channel, and a true cap-less DirectConnect™ energy efficient Class G/H headphone amplifier that consumes less then 9mW at -20dB signal level, extending music playback time for battery operated equipment.

With exceptionally low standby power of 350uW, the TSCS454xx device is ideally suited for wearables, internet of things (IoT) and applications where battery life is critical.

This new audio CODEC consists of 4 inputs that can support four digital or analog MEMS microphones and supports detection and configuration of the headphone/headset with button press for OMTP, CTIA and standard type headphones. The 5 DAC's can drive all outputs simultaneously with up to three I2S/PCM inputs and supports sample rates between 8 to 96kHz in master and slave modes. The Asynchronous Rate Conversion (ASRC) is available to handle multi-source digital inputs that exist in today's portable systems. The integrated PLL supports a large range of input and output frequencies.

TSCS454 is the first release in a new family of products that will be expanded to include third party branded audio software, such as noise suppression, acoustic echo cancellation and microphone beam forming. TSI offers complete driver support and tuning tools for faster time-to-market with Windows, Linux and Android systems, and flexibility in speaker selection and industrial design.

Pricing and Availability
The TSI TSCS454xx family is currently sampling to qualified customers and is available in a 68 pin QFN 8x8mm and 72 Ball WLCSP, 0.4mm pitch package For more information, please visit Tempo Semi /Consumer http://www.temposemi.com/products/consumer/

About Tempo Semiconductor
Based in Austin, TX, Tempo Semiconductor Inc., (TSI) is a privately held company that formed through a 2013 acquisition of IDT’s Audio Business Unit. TSI develops system-level solutions that optimize its customers’ applications. TSI is expanding this base of audio products, and delivering energy efficient, high fidelity, mixed signal semiconductor solutions to the handheld and portable device markets, as well as PCs. Headquartered in Austin Texas, TSI has Design, Manufacturing, Marketing and Sales facilities throughout the world. For more information, see http://www.temposemi.com/

DDX, TSI and the TSI logo are trademarks or registered trademarks of Tempo Semiconductor Inc., All other brands, product names and marks are or may be trademarks or registered trademarks used to identify products or services of their respective owners.

Share article on social media or email:

View article via:

Pdf Print

Contact Author

Laura Beck

Sam Kasgorgis
Visit website