SIAE MICROELETTRONICA Partners with TESSCO Technologies to Distribute Products in USA and Canada

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Complete SIAE MICROELETTRONICA North American Product Line to be available through TESSCO Technologies

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"With the addition of SIAE MICROELETTRONICA, we can offer a high capacity, spectrally efficient, and highly reliable solution that will serve as an excellent addition to our already comprehensive product portfolio.” Alex Cernik, Senior Product Manager

SIAE MICROELECTTRONICA, Inc. a leading supplier and innovator of licensed microwave backhaul solutions is pleased to announce a partnership with TESSCO Technologies, a leading provider of the product and value chain solutions required to build, use, and maintain wireless systems to become a North American distributor of SIAE MICROELETTRONICA’s microwave and millimeter wave licensed radio systems. Along with distribution of SIAE MICROELETTRONICA’s wireless backhaul solutions, TESSCO Technologies will provide pre-sales engineering and network design and post-sales services.

“Our customers are increasingly asking us to help bridge the gap between high capacity fiber systems and flexible cost effective wireless transmissions.” said Alex Cernik, Senior Product Manager for Broadband at TESSCO. “Whether mobile, fixed, or private networks, our customers need new and innovative ways to enable fast Radio Access Networks solutions. With the addition of SIAE MICROELETTRONICA, we can offer a high capacity, spectrally efficient, and highly reliable solution that will serve as an excellent addition to our already comprehensive product portfolio.”

SIAE MICROELETTRONICA is the largest independent supplier of microwave radio technology and offers a complete portfolio of products for Tier 1 carrier, service provider, and private networks with innovations including 4096QAM modulation, RF-multicore transmission, split-mount and all-outdoor architectures and advanced RF design with unique SiP technologies in the licensed frequency bands from 6 to 80 GHz. The new partnership between TESSCO and SIAE MICROELETTRONICA will help meet increasing demand from North American carriers, service providers and private network customers for innovative microwave systems equipment.

“We are extremely pleased to be partnered with TESSCO, as we bring our market-leading wireless solutions to North America,” said Augustino Lucenti, vice-president of North American sales for SIAE MICROELETTRONICA. “Our passion for developing and delivering high-quality microwave and millimeter wave solutions combined with TESSCO’s leadership in the distribution of wireless solutions offers customers with an attractive one-stop shop for network needs today and tomorrow.”

SIAE MICROELETTRONICA will be participating in the 2016 TESSCO Innovation Showcase in Phoenix, Arizona on February 23 and 24, 2016. Please stop by booth #417 to learn more about SIAE MICROELETTRONICA’s wireless solutions.

The convergence of wireless and the Internet is revolutionizing the way we live, work, and play. New systems and applications are creating challenges and opportunities at an unprecedented rate. TESSCO is there ‒ enabling organizations to capitalize on the opportunities in wireless by providing Your Total Source® of end-to-end solutions. TESSCO delivers the knowledge, and product and supply chain solutions required to build, use, maintain, and resell Cellular, Mobile Communications, Wi-Fi, Machine-to-Machine, Internet of Things, Wireless Backhaul, and Monitoring & Control systems. For more information, visit or connect with us on Twitter, LinkedIn, and Facebook.

SIAE MICROELETTRONICA, founded in 1952, is a leader in wireless communication technology. Present in over 25 countries it offers to national and multinational operators advanced technological solutions in microwave and millimetre wave transport, services and design. With in-house advances RF capabilities from design to industrialization SIAE MICROELETTRONICA products bring innovation to the market satisfying the ever-changing market requirements and customers need. For more information: or connect with us on LinkedIn.

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Joseph Schraml

Alex Cernik
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