ADLINK is committed to building the Internet of Things with products that offer exceptional value and performance.
San Jose, CA (PRWEB) March 29, 2016
ADLINK Technology, Inc., a leading global provider of cloud-based services, intelligent gateways, and embedded building blocks for edge devices that enable the Internet of Things (IoT), today announced the release of four embedded computing solutions designed with the Intel® Atom™ x5-E8000 processor. Built with 14 nm technology, the Intel® Atom™ processor boosts performance and reduces power consumption for mobility, medical, and industrial automation applications. The newly-updated COM Express® cExpress-BW, SMARC® LEC-BW, Qseven® Q7-BW modules, as well as the AmITX-BW-I thin Mini-ITX embedded board, now offer better cost-performance ratios as a result of improved computing capability.
The latest Intel® Atom™ SoC, released in Q1 2016, features 64-bit quad-core processing that is ideal for multi-tasking applications. The processor offers a configurable TDP (cTDP) of only 5 watts at 1.04 GHz, enabled by its 14 nm core transistors. With the new processor, ADLINK embedded boards and modules also support up to 8 GB of dual channel DDR3L 1600 MHz memory and up to three independent displays with Intel® HD graphics.
“ADLINK is committed to building the Internet of Things with products that offer exceptional value and performance,” said Henk van Bremen, senior director of ADLINK Module Computing Product Segment. “Our latest embedded solutions provide the most efficient design options for low-power yet graphic-intense edge applications, such as mobile tablets, medical carts, and infotainment kiosks.”
The new COM modules and Mini-ITX board run graphics processing on a base frequency of 320 MHz with eDP/DP/HDMI interfaces for up to three display ports, an increase in the number of ports over previous COM Express modules. In addition to 4K resolution, Intel® Gen9 Iris Graphics offer excellent 2D/3D hardware acceleration with decoding support for HEVC H.265, MPEG2, MVC, VC-1, WMV9, JPEG, and VP8, and encoding support for HEVC H.265 MVC, and JPEG. Graphics support also includes Open GL for graphics rendering, Intel® Quick Sync Video for fast conversion to mobile format, and Intel® clear Video HD Technology for better quality video.
With faster I/O processing and a rich selection of I/O features, ADLINK’s latest computer-on-modules satisfy the requirements for a wide range of applications. The cExpress-BW COM Express Compact Size Type 6 module offers four USB 3.0 ports, an increase over the two ports in the previous model. All new modules offer three or more USB 2.0 ports, three single-lane PCIe expansion slots, and two SATA 6 Gb/s interfaces. The AmITX-BW-I board features high connectivity with four USB 3.0 and four USB 2.0 ports, HDMI, and one single-lane and one Mini PCIe slot. With its thin Mini-ITX form factor, this embedded board serves as a space-saving solution for infotainment, industrial, and medical applications. The Q7-BW Qseven Standard Size module and LEC-BW SMARC Short Size module each offer support for two MIPI camera serial interfaces, making them ideal for stand-alone image-capture edge applications.
ADLINK embedded boards and modules are equipped with ADLINK’s Smart Embedded Management Agent (SEMA) to provide detailed system data at the device level, including temperature, voltage, power consumption, and other key information. Access to system activities allows operators to identify inefficiencies and malfunctions in real-time, thus preventing failures and minimizing downtime. ADLINK's SEMA-equipped devices connect seamlessly to the SEMA Cloud to enable remote monitoring. All collected data, including sensor measurements and management commands, are accessible from any place, at any time through an encrypted connection.
For more information on ADLINK’s offerings built with the latest Intel® Atom™ x5-E8000 SoC, please visit http://www.adlinktech.com.
ADLINK Technology is enabling the Internet of Things (IoT) with innovative embedded computing solutions for edge devices, intelligent gateways and cloud services. ADLINK’s products are application-ready for industrial automation, communications, medical, defense, transportation, and infotainment industries. Our product range includes motherboards, blades, chassis, modules, and systems based on industry standard form factors, as well as an extensive line of test & measurement products and smart touch computers, displays and handhelds that support the global transition to always connected systems. Many products are Extreme Rugged™, supporting extended temperature ranges, shock and vibration.
ADLINK Technology is a Premier member of the Intel® Internet of Things Solutions Alliance. From modular components to market-ready systems, Intel and the 350+ global member companies of the Alliance provide scalable, interoperable solutions that accelerate deployment of intelligent devices and end-to-end analytics. Close collaboration with Intel and each other enables Alliance members to innovate with the latest technologies, helping developers deliver first-in-market solutions. The company is also active in several standards organizations, including PCI Industrial Computer Manufacturers Group (PICMG), PXI Systems Alliance (PXISA), and Standardization Group for Embedded Technologies (SGeT).
ADLINK is a global company with headquarters in Taiwan and manufacturing in Taiwan and China; R&D and integration in Taiwan, China, the US, and Germany; and an extensive network of worldwide sales and support offices. ADLINK is ISO-9001, ISO-14001, ISO-13485 and TL9000 certified and is publicly traded on the TAIEX Taiwan Stock Exchange (stock code: 6166).
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