AIM’s Dillon Zhu to Present White Paper at SMTA China East Technical Conference

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AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, announces that Dillon Zhu, Regional Technical Support Manager, will present the second installment of the “Conformal Coating Over No Clean” paper by Karl Seelig, Vice President of Technology and Timothy O’Neill, Technical Marketing Manager, at the SMTA China East Technical Conference. The conference will take place from April 26th – 27th, 2016 at the Shanghai World Expo Exhibition & Convention Center in Shanghai, China.

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AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, announces that Dillon Zhu, Regional Technical Support Manager, will present the second installment of the “Conformal Coating Over No Clean” paper by Karl Seelig, Vice President of Technology and Timothy O’Neill, Technical Marketing Manager, at the SMTA China East Technical Conference. The conference will take place from April 26th – 27th, 2016 at the Shanghai World Expo Exhibition & Convention Center in Shanghai, China.

The need to increase package density and reduce costs has led to the rapid deployment of leadless packages such as QFN, POP, LGA, and Micro-BGA. In many cases, the manufacturers of these devices will mandate the use of no clean fluxes, due to concerns over the ability to consistently remove flux residues from under and around these low stand-off devices. These concerns have led to the challenge of applying conformal coating over no clean residues. In this study, AIM’s Research & Development Department paired with electronics manufacturers and conformal coating manufacturers in an attempt to characterize the different coating technologies currently available.

On April 27th, 2016, in room No. 5, B1, from 3:50pm to 4:25pm (15:50 – 16:25), Dillon Zhu will discuss the various coating materials that were tested with different chemistries of no clean fluxes, revealing possible combinations meeting the mission profile of the assembly with consideration for the assemblers’ capabilities and cost objectives.

For more information about conformal coating over no clean, please visit http://www.aimsolder.com or email info(at)aimsolder.com.

About AIM
Headquartered in Montreal, Canada, AIM Solder is a leading global manufacturer of assembly materials for the electronics industry with manufacturing, distribution and support facilities located throughout the world. AIM produces advanced solder products such as solder paste, liquid flux, cored wire, bar solder, epoxies, lead-free and halogen-free solder products, preforms, and specialty alloys such as indium and gold for a broad range of industries. A recipient of many prestigious SMT industry awards, AIM is strongly committed to innovative research and development of product and process improvement as well as providing customers with superior technical support, service and training.

For more information about AIM, visit http://www.aimsolder.com

Upcoming Events:
April 7, 2016 – SMTA Intermountain – Boise, ID
April 20, 2016 – SMTA Atlanta – Duluth, GA
April 26-28, 2016 – SMT Hybrid – Nuremberg, Germany

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